2025/05/02
PA0202 NB硬體設計工程師/高級工程師 (內湖)
仁寶電腦工業股份有限公司│電腦╱週邊設備製造
1. NB主機板之電路設計、掌控線路及layout
2. 訊號量測及異常分析、排除
3. 線路圖檢查與問題修正
4. 協助工廠提升產品良率
※依學經歷、工作年資敘薪
工作內容
1. NB主機板之電路設計、掌控線路及layout 2. 訊號量測及異常分析、排除 3. 線路圖檢查與問題修正 4. 協助工廠提升產品良率 ※依學經歷、工作年資敘薪
工作時間
日班
2025/05/02
PK0600 電源工程師/高級工程師(工作地點:高雄市)
仁寶電腦工業股份有限公司│電腦╱週邊設備製造
1.NB主機板之電源設計、掌控線路及layout
2.電源訊號量測及異常分析、排除
3.線路圖檢查與問題修正
4.協助工廠提升產品良率
※依學經歷、工作年資敘薪
工作內容
1.NB主機板之電源設計、掌控線路及layout 2.電源訊號量測及異常分析、排除 3.線路圖檢查與問題修正 4.協助工廠提升產品良率 ※依學經歷、工作年資敘薪
工作時間
日班
2025/05/02
SR0205 智慧型裝置事業群-5G行動裝置射頻電路設計工程師
仁寶電腦工業股份有限公司│電腦╱週邊設備製造
1.5G RF circuit/layout design implement
2.5G RF system architecture evaluation, RF related calibration calculation evaluation
3.5G RF overall system performance verification and process analysis
4.Overall RF certification debugging and solution
5.LTE/WCDMA/WiFi/BT/NFC performance tuning, measurement and debugging
6.Desense debugging and solution
7.Product production on site support
8.Related BOM&Document preparation
工作內容
1.5G RF circuit/layout design implement 2.5G RF system architecture evaluation, RF related calibration calculation evaluation 3.5G RF overall system performance verification and process analysis 4.Overall RF certification debugging and solution 5.LTE/WCDMA/WiFi/BT/NFC performance tuning, measurement and debugging 6.Desense debugging and solution 7.Product production on site support 8.Related BOM&Document preparation
工作時間
日班
2025/05/02
1.Identify and target potential customers for server solutions.
2.Analyze competitors and understand their offerings to better position our products.
3.Prepare and deliver sales presentations tailored to the client‘s needs.
4.Manage sales projects, including coordinating with cross-functional teams to deliver products and solutions that comply with client requirements.
5.Prepare regular reports on sales performance, market feedback, and customer needs.
6.Develop and implement strategic sales plans to achieve sales targets.
工作內容
1.Identify and target potential customers for server solutions. 2.Analyze competitors and understand their offerings to better position our products. 3.Prepare and deliver sales presentations tailored to the client‘s needs. 4.Manage sales projects, including coordinating with cross-functional teams to deliver products and solutions that comply with client requirements. 5.Prepare regular reports on sales performance, market feedback, and customer needs. 6.Develop and implement strategic sales plans to achieve sales targets.
工作時間
日班
2025/05/02
1. Mechanical Design
2. Project Management
3. Issue Analysis and Solution Capability
4. Cross Function Communication
工作內容
1. Mechanical Design 2. Project Management 3. Issue Analysis and Solution Capability 4. Cross Function Communication
工作時間
日班
2025/05/02
1. 研發、設計server及storage等系統散熱。
2. 熟悉各類散熱器及散熱產品之應用。
3. 依系統所需，制定散熱器之規格。
4. 開發新的散熱技術。
5. 進行熱傳分析及溫度量測。
內湖廠：台北市內湖區瑞光路581號
平鎮廠：桃園市平鎮區南東路8號
工作內容
1. 研發、設計server及storage等系統散熱。 2. 熟悉各類散熱器及散熱產品之應用。 3. 依系統所需，制定散熱器之規格。 4. 開發新的散熱技術。 5. 進行熱傳分析及溫度量測。 內湖廠：台北市內湖區瑞光路581號 平鎮廠：桃園市平鎮區南東路8號
工作時間
日班
2025/05/02
1. Develop and maintain the BIOS/UEFI program.
2. Initialize platform design and team up with cross-function.
3. Issue reports and support debugging with customers.
4. Research new technology and develop new features.
工作內容
1. Develop and maintain the BIOS/UEFI program. 2. Initialize platform design and team up with cross-function. 3. Issue reports and support debugging with customers. 4. Research new technology and develop new features.
工作時間
日班
•Component mean MOSFET、Dr.MOS、DC-DC IC Controller、Inductor and Capacitor.
1.Develop component level spec、test conditions and criteria.
2.Review component datasheet、spec and reliability report.
3.Enhance component quality with supplier.
4.Survey new material.
•This includes new technology assessment, creation of technology roadmaps, specification development, and application engineering knowledge for both surface mounted and through hole components.
• Additional duties include evaluating product performance and reliability test data as part of the component/supplier approval process for both new and existing components
• Work with design engineers, procurement and suppliers to determine component requirements and drive component selection and second source identification.
• Understand supplier and/or design requested changes to components and drive these changes through the formal component release and control procedures.
• Work with design engineers on the resolution of component related issues, such as timing, design margining.
• Analyze and evaluate component specifications to determine suitable alternate sources when required. This will occur for both development and sustaining products. Work with the design team, cross functional team and suppliers to ensure that components selected meet the requirements for feature set, functionality, cost, reliability, regulatory compliance, and industry standards compliance.
• Ensure components selected meet manufacturability, reliability and testability goals
※依學經歷、工作年資敘薪
工作內容
•Component mean MOSFET、Dr.MOS、DC-DC IC Controller、Inductor and Capacitor. 1.Develop component level spec、test conditions and criteria. 2.Review component datasheet、spec and reliability report. 3.Enhance component quality with supplier. 4.Survey new material. •This includes new technology assessment, creation of technology roadmaps, specification development, and application engineering knowledge for both surface mounted and through hole components. • Additional duties include evaluating product performance and reliability test data as part of the component/supplier approval process for both new and existing components • Work with design engineers, procurement and suppliers to determine component requirements and drive component selection and second source identification. • Understand supplier and/or design requested changes to components and drive these changes through the formal component release and control procedures. • Work with design engineers on the resolution of component related issues, such as timing, design margining. • Analyze and evaluate component specifications to determine suitable alternate sources when required. This will occur for both development and sustaining products. Work with the design team, cross functional team and suppliers to ensure that components selected meet the requirements for feature set, functionality, cost, reliability, regulatory compliance, and industry standards compliance. • Ensure components selected meet manufacturability, reliability and testability goals ※依學經歷、工作年資敘薪
工作時間
日班
2025/05/02
1.系統散熱與噪音設計(System Thermal and Acoustic Design)
2.專案在散熱部分的執行(Project execution on thermal related portion)
3.散熱驗證(Thermal validation)
4.開發新技術(Develop new thermal technology)
※依學經歷、工作年資敘薪
工作內容
1.系統散熱與噪音設計(System Thermal and Acoustic Design) 2.專案在散熱部分的執行(Project execution on thermal related portion) 3.散熱驗證(Thermal validation) 4.開發新技術(Develop new thermal technology) ※依學經歷、工作年資敘薪
工作時間
日班
2025/05/02
1.從事PC產品軟/韌體程式開發及問題解決、除錯、維護。
2.BIOS應用規格及流程撰寫。
3.C語言程式設計及作業系統及周邊設備控制。
4.對x86,ARM相關先進技術的軟體開發。
※依學經歷、工作年資敘薪
工作內容
1.從事PC產品軟/韌體程式開發及問題解決、除錯、維護。 2.BIOS應用規格及流程撰寫。 3.C語言程式設計及作業系統及周邊設備控制。 4.對x86,ARM相關先進技術的軟體開發。 ※依學經歷、工作年資敘薪
工作時間
日班
