台灣100大｜高薪100轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第627頁

Circuit Design Manager (Corporate Research) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16306&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for leading a group of designers to perform R&D works to evaluate PPA of circuit-level novelties and tapeout proof-of-concept chips. 2. Coordinate with multifunctional teams across Device, Circuit, and System in R&D. 3. Collaborate with external university and industry partners on research topics. 4. Convert results of innovative research into patents and publications.

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工作適配度－%

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5/13

HR Business Partner - Operations (Tainan) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台南市善化區
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16305&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. HR Business Partner is responsible for both providing HR services to employees and playing the strategic partner role to the management team for organization and talent development. Operations is the largest organization within TSMC, tasked with achieving excellence in manufacturing, process, and technology. The HR Business Partner for the Operations organization plays an important role in the growth of the company. Responsibilities: 1. Collaborate with line managers to implement annual HR activities. 2. Provide daily HR administrative support to employees and managers. 3. Monitor policies and procedures, and communicate with employees and managers in a timely manner. 4. Design and implement activities and programs to enhance organizational culture, to level up the capabilities and attitude of employees.

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工作適配度－%

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5/13

Data Protection Training and Promotion Specialist 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4261&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Following corporate data protection policy, oversee readiness and effectiveness of data protection measures to design, implement and facilitate high impact training and promotion programs 2. For overseas site data protection platform and organizational infrastructure (working team) to plan the training course and promotion activities schedule and resources 3. Manage and leverage corporate promotion resources to fulfill localized learning and promotion needs 4. Ensure the effectiveness of data protection promotion activities follow-up Additional information for the job: 1. Job Location: Hsinchu Site 2. On-call needs: No 3. The complete interview process includes: (1) Hiring Manager 1st interview (2) On-site personality and English test, which could be replaced if you have a transcript of officially recognized English test (3) HR interview (4) If passed 1st interview, will have 2nd interview with Director

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/13

Data Scientist Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=517&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Ideal candidates would have either a Master’s degree or a Ph.D. in computer science, information systems, information science or related fields. The responsibilities of this role include developing machine learning, deep learning, text mining, and/or network science-based approaches to extract insights from structured (transactional) and unstructured data sources.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/13

HBM Integration & Applications Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4589&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop, test, and integrate HBM solutions into products. 2. Collaborate with cross-functional teams to ensure successful integration of HBM solutions. 3. Work closely with memory vendors to develop and optimize HBM solutions. 4. Create and maintain technical documentation related to HBM integration and testing. 5. Troubleshoot and resolve issues related to HBM integration and performance. 6. Participate in the development of new products and technologies related to HBM.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/13

Quality and Reliability Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=352&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Reliability data test, analysis,and monitor. 2. New hotspot pattern and test methodology study for WAT(Wafer Acceptance Test) monitoring. 3. FAB process change management for reliability risk assessment management. 4. Circuit reliability and product reliability. 5. Customer service on reliability.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/13

TCAD Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=560&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Conduct TCAD and SPICE model development in the field of emerging memory devices 2. Provide simulation support to the experimental and circuit design teams 3. Location: Hsinchu, Taiwan

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/13

R&D Power Grid Design and Sign-Off Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=475&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Organization Introduction: We are power grid design and sign-off team for digital design inside TSMC. The mission is to develop power grid design and co-optimize with semiconductor process in advanced technology nodes for most updated commercial design contents (CPU, GPU, SoC, etc.) Our power grid designs are references for worldwide 1st Tier design houses. Responsibilities: 1. Develop power grid structure for most updated commercial design contents (CPU, GPU, SoC, etc.) and check IR/EM (Electron-Migration) performance. 2. Provide design solutions for IR/EM and routing optimization. 3. Co-work with process R&D for process tuning to achieve better PDN (Power Delivery Network) design. 4. Support TSMC advanced process node test chip PDN sign-off checks, including PDN quality check, static/dynamic IR sign-off, and EM sign-off for successful chip tape-out. 5. Provide guidance and suggestion to PnR (Place and Route) designer on PDN issue fixing.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/13

R&D Advanced Tool and Module Process Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=324&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced module process development and baseline sustaining 2. Process stability/manufacturability improvement for yield and reliability qualification 3. Process/tool transfer to volume manufacturing

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工作適配度－%

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5/13

Backend Software Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=541&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Role: Software Engineer, Backend Development at TSMC IT focus on designing the most flexible, scalable backend architecture with optimized performance to support TSMC world-class manufacture, engineering and business systems. The ideal candidate has a highly technical multi-discipline engineering skillset that can push the limits of complex system design at large scale. Responsibilities: 1.Implement the features and services of backend for TSMC software products 2.Develop state-of-the-art code 3.Continue to refactor existing applications 4.Contribute to write tests to ensure software quality 5.Apply software design principles to ensure software quality 6.Ensure sustainability and performance of software applications 7.Willing to learn new IT technologies

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/13

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