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Specialty Technology Module R&D Engineer_台南
面試心得
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企業名
台灣積體電路製造股份有限公司(台積電)
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工作地點
台南市善化區
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薪資
月薪34000~38000元
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工作內容
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=392&source=1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
In R&D, special technologies and mature processes are necessary for the continuous stable growth of TSMC.
Specialty Technology builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules.
Responsibilities:
1. R&D Process Engineer (Etch)
(1) Be highly motivated and possess a strong technical background, demonstrating capabilities to develop and sustain etch process technologies for R&D specialty products.
(2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.
(3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and improvements.
2. R&D Process Engineer
(1) Responsible for CVD/PVD/CMP/Grind/Trim/DIF/BOND development activities in R&D specialty module.
(2) Deliver innovation and solution to conquer the problems in wafer stacking processes.
(3) Maintain processes POR and SPC control.
3. R&D Integration Engineer
(1) Responsible for lot handling and process flow setup.
(2) Process flow optimization to improve WAT or yield performance.
(3) Need support holiday on-duty.
台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區
https://central1111.com.tw/turn/