台灣1000大｜外商公司轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第649頁

Supply Chain Logistic Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=513&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. At TSMC, We Develop the Technologies that Shape the Future and Change the World! Technology is our cornerstone, and Innovation is our passion. At TSMC, we bring together the most creative minds in science and technology to provide the best foundry services possible, and drive innovation in fields that revolutionize our world and daily lives including high performance computing, mobile, automotive electronics, and the Internet of Things. If you want to challenge yourself and unleash innovation with brilliant colleagues located around the world, come join us! The Role: Are you passionate about the logistics and supply chain management for one of the most advanced semiconductor manufacturing in the world? TSMC is looking for a Supply Chain Logistic Management Engineer to work on optimizing cost-efficiency, smart operations and green transportation. As our Logistics and Supply Chain Management Engineer, you will not only conduct warehouse operation management, but also help us achieve supply chain excellent performance by continually improvement projects/tasks, including automation warehouse design, robotic process automation, vendor management, and process improvement projects. Major Work Focus: 1. Warehouse operation owner to process improvement project/task: Continually improve the efficiency and quality of daily operation. Logical thinking and problem solving ability to systematically solve daily challenge. 2. Cross functional enhancement project(s) for supply chain excellence: Collaborate with supply chain colleagues, including material planner, procurement, and wasted material team to meet excellent supply chain performance. Responsibilities: Your main responsibilities include, but are not limited to: 1. Lead/coordinate cross functional to achieve supply chain excellence. 2. Initiate and implement continuous logistics and warehouse process improvement project/task. 3. Study and introduce leading-edge logistics/warehouse automation, including H/W & S/W(e.g. ASRS, AGV, Robot, B2B data flow, RPA…) Please refer to TSMC CSR: https://csr.tsmc.com/csr/ch/update/inclusiveWorkplace/caseStudy/21/index.html 4. Lead teammates and collaborate with suppliers to achieve supply chain excellence in materials preparation. WHY TSMC: 1. A COMPANY that drives worldwide information technology by empowering the foremost technology companies with manufacturing capabilities that match their innovation. 2. A CAREER where you can work with smart peers around the world and to work together in a challenging and ever-evolving industry. 3. A WORKPLACE that provides career development, access to state-of-the-art technology, a sense of comradery, and responsibilities.

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7/28

Site Reliability Engineer-身心障礙人才招募面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=535&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Role: We are looking for a highly motivated and critical-thinking site reliability engineer to join our Infrastructure & Communication Services Division. The ideal candidate should have exposure to systems in both staging and production and all technical teams. This position requires software development, support, IT operations, and on-call duties experience. Responsibility: 1. Develop state-of-the-art applications. 2. Continue to refactor existing applications. 3. Transform repeatable tasks into automation tools. 4. Contribute to writing tests to ensure software quality. 5. Apply software design principles to ensure software quality. 6. Ensure sustainability and performance of applications. 7. Collaborate with peers in design and code reviews. 8. Willing to learn new IT technologies.

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工作適配度－%

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7/28

SAP ERP System Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=300&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1.Analyze Biz.(i.e. Finance, Accounting, Procurement, Warehouse, Import/Export, …) users’ requirement. 2. Design, develop, and maintain SAP S/4 HANA, SAP EWM, BI, Group Reporting, and SAP Cloud solution with cross system integration. 3. Build data platform integration for finance and logistics domain. 4. Manage requirement, project schedule, and deliverables.

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工作適配度－%

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7/28

R&D Power Grid Design and Sign-Off Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=475&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Organization Introduction: We are power grid design and sign-off team for digital design inside TSMC. The mission is to develop power grid design and co-optimize with semiconductor process in advanced technology nodes for most updated commercial design contents (CPU, GPU, SoC, etc.) Our power grid designs are references for worldwide 1st Tier design houses. Responsibilities: 1. Develop power grid structure for most updated commercial design contents (CPU, GPU, SoC, etc.) and check IR/EM (Electron-Migration) performance. 2. Provide design solutions for IR/EM and routing optimization. 3. Co-work with process R&D for process tuning to achieve better PDN (Power Delivery Network) design. 4. Support TSMC advanced process node test chip PDN sign-off checks, including PDN quality check, static/dynamic IR sign-off, and EM sign-off for successful chip tape-out. 5. Provide guidance and suggestion to PnR (Place and Route) designer on PDN issue fixing.

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工作適配度－%

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7/28

R&D Advanced Tool and Module Process Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=324&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced module process development and baseline sustaining 2. Process stability/manufacturability improvement for yield and reliability qualification 3. Process/tool transfer to volume manufacturing

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工作適配度－%

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7/28

A10 RD Engineer (Coding) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=328&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. Develop AI rule generator and QC pattern generator for complex design rule. 2. Automation for Design Rule Quality Check flow by python. 3. Automation for Design Rule Quality Check flow by excel VBA. 4. Advance technology and design co-optimization for manufacturing & PPAC.

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7/28

A10 RD Device Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=302&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. 10 Å CMOS platform technology development. 2. With focus on transistor characterization, design, targeting, and performance step-up. 3. Lot handling & on-duty (night shift and weekend) rotation.

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7/28

Specialty Technology Module R&D Engineer_台南面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台南市善化區
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=392&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. In R&D, special technologies and mature processes are necessary for the continuous stable growth of TSMC. Specialty Technology builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules. Responsibilities: 1. R&D Process Engineer (Etch) (1) Be highly motivated and possess a strong technical background, demonstrating capabilities to develop and sustain etch process technologies for R&D specialty products. (2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. (3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and improvements. 2. R&D Process Engineer (1) Responsible for CVD/PVD/CMP/Grind/Trim/DIF/BOND development activities in R&D specialty module. (2) Deliver innovation and solution to conquer the problems in wafer stacking processes. (3) Maintain processes POR and SPC control. 3. R&D Integration Engineer (1) Responsible for lot handling and process flow setup. (2) Process flow optimization to improve WAT or yield performance. (3) Need support holiday on-duty.

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7/28

Mask Process Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台南市善化區
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=286&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for Mask process 2. Smooth product pilot run for next generation process 3. Continue improvement in tools reliability and stability. 4. Advanced technology transfer and Continuous Improvement Plan(CIP). 5. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for flash memory and logic products. 6. Working with a team which may include device, integration, yield, lithography or external suppliers to drive leading-edge integrated module development, control, and improvements. 7. Be responsible for sustaining ownership, such as day-to-day operations, equipment troubleshooting, and mentoring technicians.

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7/28

Mask Equipment Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台南市善化區
薪資面議（經常性薪資達4萬元或以上）40000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址：https://careers.tsmc.com/careers/JobDetail?jobId=293&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Mask equipment maintenance and trouble shooting. 2. New mask equipment installation. 3. Efficiency and throughput improvement on mask equipment. 4. Continuous improvement on mask quality. 5. Cooperation with equipment vendors and cross-functional engineers.

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工作適配度－%

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7/28

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