台灣1000大轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第1180頁

Legal Assistant (1-Year Contractor) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪33400~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/en_US/careers/JobDetail?jobId=16636&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a highly efficient and detail-oriented Legal Assistant to join our team. This position involves a variety of challenging tasks, including supporting our attorneys on patent litigations and disputes, document management, administrative assistance, organizing meetings, hosting visitors, and expense processing. You will have the opportunity to contribute to process optimization, enhance team efficiency, and demonstrate your organizational and professional skills in a fast-paced environment. This role is ideal for individuals with strong multitasking abilities and communication skills who are eager to grow personally and professionally while supporting a team of legal professionals. Responsibilities: 1. Legal Project Support: Assist attorneys with patent litigation/dispute projects, including document organization, process tracking, research, and preparation of presentations/reports. 2. Document and File Management: Organize, archive, and maintain departmental documents to ensure systematic access and data security. 3. Administrative Assistance: Support daily administrative tasks and project execution to enhance departmental efficiency. 4. Organizing Meetings: Schedule meetings, prepare agendas and relevant materials, and ensure all necessary equipment is properly set up. 5. Hosting visitors: Professionally welcome clients and partners, coordinate visitor entry and exit processes, and project a positive company image. 6. Expense Reporting and Reimbursement: Process expense reports and reimbursements with accuracy, ensuring compliance with company policies. 7. Monthly Salary Range: from $33,400.

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8/5

資材管理助理面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄址: https://careers.tsmc.com/careers/JobDetail?jobId=16620&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。說明: 1. 部門及主管日常行政事務(會議安排與人員協調以及後勤/辦公室業務/差勤申請/安排旅行和酒店預訂/費用核銷報支請款等等)，執行行政職責。 2. 提供精確有效的電腦技能，接聽電話和接待訪客。 3. 作為聯繫窗口，聯繫外部單位，並與內部部門/職能協調。 4. 職能協調進行預算規劃和管理執行分配的其他職責。 5. 支援各部門及處內相關活動。 6. 協助採購及物料管理人員完成例行事務。 7. 薪資範圍: 33,000以上。

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8/5

Scrum & Talent Analytics Specialist 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市東區
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16608&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Are you passionate about driving success through agile processes and data-driven insights? As a Scrum & Talent Analytics Specialist, you will join in HR strategy planning cycling, optimize resources, boost talent analytics insight, and deliver solutions with the teams together. This role blends Scrum management, data analysis, digital opportunity pathfinding, and cross-domain HR knowledge to execute HR priorities and build capabilities. If you excel in dynamic, global environments and value innovation and collaboration, this role is for you! Responsibilities: 1. Scrum management (1) Support the facilitation on HR divisional priority planning. (2) Support Org & Talent feature release and related product communication for business needs. 2. Data collection and insights analysis (1) Monitor HR product effectiveness and identify opportunities for improvement. (2) Observations with ad-hoc data request and analysis. 3. Knowledge management & capability building (1) Support HR cross-domain research team for bringing outside in market insight and internalizing it into Org & Talent product and feature. (2) Support HR cross-domain knowledge management and capability building. 4. Resource pooling management (1) Support the in-division resource planning and deployment.

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8/5

Sr. HR People Partner - Support Delivery Excellence 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16593&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Sr. HR People Partner – Support Delivery Excellence focuses on optimizing HR service delivery to enhance both employee and manager experiences. This role drives excellence in HR operations by integrating People Experience, Manager Experience, HR Shared Services, Process Optimization, and Stakeholder Collaboration. The incumbent will act as the bridge between HR functions and business needs, ensuring the delivery of efficient, scalable, and impactful HR solutions. Responsibilities: 1. Service Delivery Optimization: Standardize HR processes across HR People Partners to ensure consistency and efficiency in areas like staffing, onboarding, employee data management, talent management, and business administration. 2. People & Manager Experience: Design initiatives to improve employee satisfaction and manager effectiveness. Provide tailored support to managers on performance management, management tool enablement, and daily operational needs. 3. Process Excellence: Identify and address bottlenecks in HR workflows. Implement automation tools and technology solutions to improve delivery accuracy and efficiency. 4. Stakeholder Collaboration: Partner with HRBPs and business leaders to align HR support priorities. Act as an expertise representative in HR function to integrate and deliver customized HR solutions. 5. Data-Driven Decision Making: Track and analyze service delivery metrics, employee satisfaction scores, and manager feedback. Use insights to continuously refine HR support models and improve satisfaction levels. 6. Continuous Improvement: Monitor KPIs and implement ongoing enhancements to HR services, focusing on scalability, effectiveness, and alignment with business demands. Role Value: The HR People Partner – Support Delivery Excellence drives operational excellence in HR by optimizing processes and enhancing stakeholder satisfaction. Through tailored solutions and continuous improvement, this role ensures HRPP becomes a proactive enabler of meaningful experiences for employees and managers alike.

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8/5

Financial IT Specialist- FRMD (Financial Risk Management Department) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16588&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are looking for an experienced IT Specialist to support the digital transformation of our corporate finance systems. This role requires a hands-on technologist with solid software development skills and a strong understanding of treasury operations and AI/ML integration. Key responsibilities include: 1. Design, develop and enhance the IT infrastructure within Finance Division. 2. Work closely with finance teams to understand needs and deliver technical solutions. 3. Develop and maintain code in Java, JavaScript, and SQL environments. 4. Integrate AI/ML models into finance systems for predictive analytics and automation. 5. Ensure system security, scalability, and compliance with financial regulations.

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

Digital Finance Specialist- FRMD (Financial Risk Management Department) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16589&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are looking for a dynamic and results-driven Digital Finance Specialist with a strong background in finance and a passion for digital transformation. The ideal candidate will lead cross-functional initiatives, leveraging data analytics and emerging technologies such as AI/ML to drive strategic innovation within the corporate finance domain. Key responsibilities include: 1. Identify opportunities for automation and AI/ML integration in financial processes. 2. Lead and manage finance-related digital transformation projects from planning through execution. 3. Collaborate with stakeholders across departments to gather requirements and align project goals. 4. Support development and implementation of digital solutions for Treasury operation, utilizing Python, AI and BI tools.

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8/5

【2026 TSMC RDSS & AO】Materials Management Engineer (MM) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Opening roles for you: 1. Global Procurement and Supply Planning Professionals 2. Global Logistics Digital Transformation Engineer 3. Responsible Supply Chain Management Engineer 4. Supply Chain Auditor 5. Resource Recovery Management Engineer For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

【2026 TSMC RDSS & AO】Corporate Planning Organization (CPO) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency and reach profit maximization. 2. We drive for business effectiveness to bring world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. 4. We seek individuals who meet the following criteria: (1) Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. (2) Have skills in logic thinking and communication, learning agility, and business acumen. Opening roles for you: 1. Account PC Planner 2. Fab Production Control Planner 3. Fab Rationalization Engineer 4. Operation Resources Planning Engineer 5. DevOps Engineer 6. ML/AI Engineer 7. Corporate Planning Associate For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111

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8/5

【2026 TSMC RDSS & AO】Research and Development Engineer (R&D) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.

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8/5

【2026 TSMC RDSS & AO】Design and Technology Platform Engineer (DTP) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪33000~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

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