台灣1000大轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第1189頁

技術員 (英文專才) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台南市善化區
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5381&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。說明: 1. 海外廠訓練協助工作 : 配合海外廠的建設與運作，使用指定語言協助廠區當地人才培訓工作，並協助與當地員工間的溝通 2. 線上工作： (1) 使用自動化電腦派工系統監控產線機台與生產相關指標 (2) 溝通協調相關單位，協助處理機台、派工等產品生產異常狀況 (3) 在無塵室內進行晶圓盒的拆/包裝及原物料的盤點作業 3. 工作場所 : 黃光無塵室+辦公室 4. 採四班二輪制：工作兩天，休息兩天 5. 需輪班：依部門而異，3~5個月夜班、3~5個月日班 6. 班別工作區間(含休息時間)：日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM 7. 日班總月薪約32,000 元；夜班總月薪約 43,000 元；另享有分紅獎金，並依表現發放外語翻譯訓練獎金，平均年薪達75 萬元以上；派任期間，另有外派獎金及相關津貼

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

工程技術員 (德文專才) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台中市西屯區
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5379&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。說明: 1. 海外廠訓練協助工作 : 配合海外廠的建設與運作，使用指定語言協助廠區當地人才培訓工作，並協助與當地員工間的溝通 2. 線上工作：協助工程師處理線上事務，包含產品異常處置與機台異常復歸(與設備工程師協調合作)，追蹤與執行工程師交接事項 3. 採四班二輪制：工作兩天，休息兩天 4. 需輪班：依部門而異，3~5個月夜班、3~5個月日班 5. 班別工作區間(含休息時間)：日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM 6. 日班總月薪約32,000 元；夜班總月薪約 43,000 元；另享有分紅獎金，並依表現發放外語翻譯訓練獎金，平均年薪達75 萬元以上；派任期間，另有外派獎金及相關津貼

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

技術員 (德文專才) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台中市西屯區
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5378&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。說明: 1. 海外廠訓練協助工作 : 配合海外廠的建設與運作，使用指定語言協助廠區當地人才培訓工作，並協助與當地員工間的溝通 2. 線上工作： (1) 使用自動化電腦派工系統監控產線機台與生產相關指標 (2) 溝通協調相關單位，協助處理機台、派工等產品生產異常狀況 (3) 在無塵室內進行晶圓盒的拆/包裝及原物料的盤點作業 3. 工作場所 : 黃光無塵室+辦公室 4. 採四班二輪制：工作兩天，休息兩天 5. 需輪班：依部門而異，3~5個月夜班、3~5個月日班 6. 班別工作區間(含休息時間)：日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM 7. 日班總月薪約32,000 元；夜班總月薪約 43,000 元；另享有分紅獎金，並依表現發放外語翻譯訓練獎金，平均年薪達75 萬元以上；派任期間，另有外派獎金及相關津貼

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

A14 R&D Device Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5354&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We invite you to become an integral part of our forward-thinking team, where you will be at the vanguard of nanosheet transistor device design for our prestigious A14 technology initiative. This role offers a unique opportunity to work on the frontier of semiconductor innovation, collaborating with industry leaders and contributing to technologies that define the next generation of electronics. Responsibilities: 1. Pioneering Nanotechnology Development: (1) Seamless Integration: Integrate devices across various process modules, including the creation of test keys, execution of tape-outs, meticulous device analysis, advanced simulations, and fortification of model integrity. (2) Innovative Design: Craft precision test key designs to facilitate accurate electrical modeling and comprehensive device characterization. (3) Advanced Characterization: Define the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting occasional bench measurements. (4) Experimentation: Design experiments to meet device KPIs for performance and periodically serve as the on-duty engineer to coordinate device process management. 2. Diagnostic Analysis: Critical Data Assessment: Apply your analytical expertise to dissect transistor electrical and physical data, pinpointing issues and identifying responsible parties for targeted resolution. 3. Collaborative Problem-Solving: Interdisciplinary Teamwork: Join forces with a spectrum of specialized teams to scrutinize and appraise new processes, driving the resolution of complex challenges through collective insight and expertise.

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

A14 R&D Integration Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Aspire to be a part of a visionary team that develops world-class, cutting-edge technology for the A14 platform? This is a call to those who wish to delve into the realm of interconnect and chip/package (2D/3D) co-optimization, where your work will be integral to our success. Responsibilities: 1. Championing Technological Excellence: (1) Optimization Wizardry: Ensure the A14 program excels by harmonizing process requirements across performance, yield, reliability, and manufacturability through strategic process integration and baseline maintenance. (2) Design & Validation Expertise: Lead the tape-out process and rigorously test key designs to validate design rules, refine electrical modeling, and elevate yield outcomes. (3) Benchmarks & Characterization: Analyze and characterize the electrical performance relative to the process, establish SPICE modeling benchmarks, and perform selective bench measurements to guarantee precision and quality. 2. Collaborative Innovation: (1) Analytical Problem-Solving: Bring your innovative mindset to team efforts, using data analysis to uncover process issues and co-developing new processes as solutions alongside talented peers. (2) Process Evolution: Play a pivotal role in evolving processes from advanced integration baselines to full-scale volume production, ensuring a smooth transition and exemplary results.

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

A14 R&D SRAM Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5351&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Embark on a career journey with us, where innovation meets impact. We are searching for a dedicated professional to join our elite team, harnessing the world‘s most sophisticated technology to engineer SRAM that impacts the lives of millions globally. Responsibilities: 1. Spearhead A14 SRAM Development: (1)Yield and Device Optimization: Apply your analytical prowess to enhance SRAM/Device performance and ensuring excellent yield. (2)SRAM Cell Design and Testing: Craft cutting-edge SRAM cells and conduct critical process window evaluations to guarantee optimal design resilience. (3)SRAM Characterization and Validation: Utilize advanced simulation tools to characterize and validate SRAM, paving the way for silicon success. 2. Collaborative Excellence: Cross-Functional Teamwork: Engage with a network of experts across various specialties, including Integration, Design, Product, and Reliability, to fortify SRAM cell robustness. 3. Identify issues and build up methodology, propose solutions and evaluation plans.

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

Global Compensation Planner (Europe) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5349&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Partner with country HR and business functions by delivering compensation solutions that support business objectives. Co-work with local C&B/Talent Acquisition teams on external offers. 2. Prepare regular business/organization related reports for review and analysis to facilitate related parties in making organization improvements and/or business decisions. 3. Apply effective communication tactics to country HR in supporting/solving compensation & incentive related questions and issues.

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

Intelligent Process Control System Engineer (IMC) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5309&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Intelligent Process Control Systems Department (IPCS) in TSMC‘s Intelligent Manufacturing Center (IMC) assists fabs in analyzing process issues. By employing techniques such as experimental design, statistical analysis, optimization algorithms, and machine learning, the department establishes R2R (Run-to-Run) process control models. Subsequently, in collaboration with the system development team, an automated control platform is established and rolled out across various fab zones. This integration aims to enhance staff efficiency and improve overall product quality. Responsibilities: 1. By employing methods such as control system development, algorithm design, and control performance diagnostics, we provide advanced control systems for the semiconductor industry. 2. We use machine learning and optimization algorithms to build models that deliver solutions meeting the needs of the fab zones. 3. We establish automated platforms that utilize techniques such as machine learning and AI for automatic parameter optimization, which reduces staff workload and enhances quality. 4. In collaboration with the system development team, we systematically implement and roll out innovative methods or improvements across various fab zones to boost staff efficiency and product quality. Work Location: Hsinchu/Taichung/Tainan

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

Intelligent Scheduling Engineer (IMC) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5308&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Intelligent Scheduling Development Department (ISDD) in TSMC‘s Intelligent Manufacturing Center (IMC) is responsible for the dispatch and scheduling of various TSMC fabs. It considers multiple constraints such as processes, machines, products, and waiting times, and employs three main methods: 1. Automated rules (Rule based) 2. Optimization through mathematical planning models (Model) 3. Optimization with metaheuristic algorithms (Metaheuristic) The system determines the sequence of products that machines will produce in the future. Colleagues continuously refine the computational engine to improve solving performance and scheduling quality. They also utilize self-developed scheduling systems to help fabs adapt to various scenarios to achieve fab goals and tasks. Moreover, they constantly enhance fab production efficiency and increase wafer output by identifying and capitalizing on opportunities for improvement. Responsibilities: 1. Develop and maintain Scheduling / Dispatching and Manufacturing Report System. 2. Communicate with users to define requirements, design, implement, and deploy systems, and continuously improve them using software engineering methodology. 3. Design system architecture of cross department projects. 4. Lead system design review. 5. Survey and introduce new IT solutions.

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

Site Reliability Engineer (IMC) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5307&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Infrastructure and Platform Engineering Department (IPED) in TSMC‘s Intelligent Manufacturing Center (IMC) is dedicated to enhancing system stability and developer productivity. As TSMC‘s production scale continues to expand, the core focus is on smart manufacturing through deep system integration to maintain high yield and efficiency. Within this team, you will assist in implementing new cloud architectures (K8S) and other related cloud-native technologies to achieve the goals of DevOps. General job responsibilities for this job position are: 1. Develop and maintain cloud-native related systems based on the K8S architecture. 2. Tune system configurations based on metrics and user feedback. 3. Work closely with internal development teams and seek new tools that can enhance productivity. 4. Conduct POC (proof of concept) and assist internal development teams with implementation. Job Location: Hsinchu/Taichung (preferred) On-Call Needs: 1. Regular rotation: On-call for 1 week every 3 months. 2. Event: In cases affecting the production line, remote connection to the company for issue resolution is required.

查看更多

應徵

工作適配度－%

登入後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

8/5

轉職找工作推薦

轉職工作職缺結果