台灣外商公司｜高薪100轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第274頁

📌《知名企業》行政人員
企業名捷招管理顧問有限公司
工作地點台北市松山區
薪資月薪30000~32000元
工作內容工作內容簡介： 📌保單、付款憑證分類整理、裝訂、核章 📌將支票或轉帳文件送給相關主管簽核，跑流程 📌負責聯繫收款方拿付款證明（取條）傳真給銀行，或直接跑銀行幫忙辦理匯款或轉帳 📌支票開好後，負責寄出或送交 📌信件收發

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

台南新市–日商半導體行政助理
企業名捷招管理顧問有限公司
工作地點台南市新市區
薪資月薪30000~32000元
工作內容協助正工程師處理辦公室行政文書工具部品管理需進客戶端(台積電為主)無塵室抓資料其它主管交辦事項

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

【2026 TSMC RDSS & AO】Intelligent Manufacturing Engineer (IMC/MFG) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪30000~32000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16573&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer 2. CIM Intelligent Manufacturing Engineer 3. Data Analyst & Data Scientist 4. AMHS (Automated Material Handling System) Engineer 5. PIDS/WAT (Wafer Acceptance Test) Engineer 6. PIDS/NTO (New TapeOut) Engineer 7. Quality Management Engineer

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

【2026 TSMC RDSS & AO】Facility Engineer (FAC) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪30000~32000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16574&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 4. Construction management & project coordination.

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

N【台中后里區】百貨機電行政，薪32,000~35,000元面試心得
企業名 ABV 物業管理_安橋保全股份有限公司
工作地點台中市后里區
薪資月薪32000~35000元
工作內容一、工作內容 . 機電相關資料彙整及報表分析 .人力調度與協調 .零用金管理及請款資料匯整 .人員到離職系統建檔及異動作業 .完整薪資系統作業 .協助駐地主管及業主相關行政事務 .其他交辦事項二、時間： 08:00-17:00 三、休假 : 國定例假日排休四、薪資：32,000~35,000元五、福利 .勞保、健保(依法投保) .年節禮券或禮金 .生日禮券 .結婚補助金與結婚禮金 .生育補助金 .年終獎金 .公司負擔6﹪退休金(依實際薪資級距提撥) .健康檢查 .提供制服、不押保證金 .提供專業教育訓練及核發證照 . 完整的人事管理與升遷制度

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

【2026 TSMC RDSS & AO】Product Engineer (PE) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~35000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

【2026 TSMC RDSS & AO】Advanced Packaging Technology and Service Engineer (APTS) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~35000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

【2026 TSMC RDSS & AO】Quality & Reliability Engineer (Q&R) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~35000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16577&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis, manufacturing production quality management and reliability assessment, research, and development of new analysis protocol. 3. Customers problem resolving for production quality / reliability issues.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

営業担当。(機能品營業部)(台北)
企業名台灣東洋先端科技股份有限公司
工作地點台北市中山區
薪資月薪40000~0元
工作內容 1、主要負責維繫既有客戶關係、開發新客戶及銷售通路，並在與日本總公司密切協作下，推動國際專案與業務合作。 2、負責日本進口之接著劑、粘著劑、硬化劑、膠帶、樹脂及開發產品在台灣市場的銷售推廣，特別專注於半導體及顯示器市場的擴展。 3、使用日中雙語獨立撰寫商務郵件及簡報資料。 4、視工作需求配合短期日本出差。 5、其他主管交辦業務。 6、以上相關銷售業務及客戶對應之相關促進活動。

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

電腦稽核
企業名彰化商業銀行股份有限公司
工作地點台北市中山區
薪資月薪43000~66000元
工作內容 ※必要資格條件 1.學歷：國內、外大學(含)以上，且已取得學位(畢業)證書。 2.工作經驗(至少符合下列其中一項)： (1)具有2年以上金融檢查之經驗。 (2)具有5年以上金融業務之經驗。 (3)曾任會計師事務所查帳員、電腦程式設計師或系統分析師等專業人員2年以上之經驗。 ※口試得加分項目： 1.具備ISO27001、ISO22301、BS10012、ISO27701 主導稽核員專業證照之一。 2.稽核人員研習班、電腦稽核研習班60小時以上課程，並經考試及格且取得結業證書。 3.具國際電腦稽核師證照(CISA)或國際資訊安全經理人(CISM)。 4.具備下列專業能力： (1)電腦審計(含OS、AP、DB、Network等)。 (2)資料探勘及數據分析。 (3)視學化(如Tableau、PowerBI等)。 (4)熟悉程式語言(如C#、Python、R、NET、JAVA、SQL等)。 (5)新興科技風險(如區塊鏈、人工智慧、RPA、雲端運算、敏捷式稽核等)。 ◎工作地點為臺北市，惟須配合海、內外出差。

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/16

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