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【技術中心】先進封裝工程師(Advanced Assy Eng )
面試心得
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企業名
日月光半導體製造股份有限公司(日月光)(中壢廠)
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工作地點
桃園市中壢區
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薪資
月薪38200~65000元
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工作內容
●FCB/TCB/UF/HS/SMT/AOI/Compression Mold process relating machine implement.
1.NPI Process Development: Study machine parameters to establish NPI product build-up.
2.Machine Capability Study: Conduct Machine Capability studies and provide improvement solutions.
3.Data Analysis: Design DOE and perform statistical analysis to define Key Factors.
4.Evaluation & Verification: Evaluate and verify the introduction of new equipment and materials.
5.Abnormality Analysis: Perform production process abnormality analysis and establish specifications.
6.Project Management: Execute and manage technical development projects.
7.Equipment Application: Hands-on experience with FC Bonder, Reflow, or Flux Cleaner operation and maintenance.
日月光半導體製造股份有限公司(日月光)(中壢廠)-使用1111轉職專區
https://central1111.com.tw/turn/