工作內容1. Package related structure stress analysis including warpage, material study.
2. Package and board level stress modeling for TCT, drop and vibration.
3. IC and package thermal analysis, modeling and characterization
4. Chip-Package-PCB thermal co-simulation and design.
5. System level thermal simulation
6. System level stress simulation
工作內容1. Modem and AP SOC product planning, market analysis and technical feasibilty evaluation.
2. Product go to market planning, product marketing.
3. Business engagement and project execution with Worldwide tier-one customers.
工作內容1. AI SW task management and SW strategy development
2. Software developments of AI/GAI and its applications on automotive and Smart home products
3. OEM engagement for new application exploration
1. 負責AI SW任務管理與SW策略制定
2. 負責AI/GAI軟體開發及其在汽車、智慧家庭產品的應用
3. 參與OEM新應用探索