轉職找工作推薦

  • Demand Analyst/Manager – PC/Server 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 面議(經常性薪資達4萬元或以上)40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16532&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a Demand Analyst/Manager specializing in PC/Server within the Business Operations Division, you will play a key role in assessing PC/Server IC demand at TSMC. Your responsibilities include analyzing market dynamics and trends across the PC and server supply chain by utilizing effective business intelligence tools, as well as quantifying their impact on the company through numerical demand modeling. Your insights will support corporate forecasting, capacity allocation, and fab rationalization strategies, ensuring alignment with TSMC‘s operational goals. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
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3/2

  • R&D IIP Simulation Engineer 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 面議(經常性薪資達4萬元或以上)40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16521&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a highly motivated and talented R&D Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis. Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions. Responsibilities: 1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements. 2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs. 3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
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工作適配度%

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3/2

  • Global Payroll Specialist 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 面議(經常性薪資達4萬元或以上)40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16517&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Are you ready to play a pivotal role in shaping the future of global payroll operations at a world-leading company? Join TSMC as a Global Payroll Specialist and immerse yourself in our exciting globalization and transformation journey. In this role, you will take center stage in leading and resolving payroll-related challenges across multiple countries, ensuring alignment with headquarters standards and compliance with international regulations. Responsibilities: 1. Establishment of new sites: (1) Design payroll process flows and implement payroll systems. (2) Set up time & attendance policies and deploy relevant systems. (3) Identify opportunities to streamline processes and improve efficiency. 2. Enhancement and integration of existing operations: (1) Manage global payroll calculations and resolve discrepancies across multiple countries, ensuring accurate and timely payment processing. (2) Harmonize payroll policies and terms between headquarters and global offices by implementing consistent operational models, while ensuring compliance with international labor laws. Bring your passion and talent to TSMC and thrive! Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

3/2

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3/2

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3/2

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

3/2

  • IT Infrastructure Engineer 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪29500元 以上
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=555&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking outstanding engineers to join TSMC IT infrastructure team to build and operate IT advanced Data Center to support world-class semiconductor foundry. This team is responsible for designing, implementing and optimizing IT infrastructure towards software-defined computing, storage and networking with advanced cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Job Responsibilities: Your responsibilities include: 1. Network/Storage Design and Management: (1) Design, construction, operation, and capacity planning of large-scale NAS storage/object storage. (2) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (3) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. 2. Automation and Scripting: (1) Develop and maintain automation scripts for network configuration, monitoring, and management using tools like Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. 3. Application Development: (1) Develop state-of-the-art applications and refactor existing applications for improved performance and maintainability. (2) Write and implement tests (unit/feature/integration) to guarantee software integrity. 4. Monitoring and Troubleshooting: (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Perform root cause analysis and corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Infrastructure operation issues(network/server/storage/security) visualization and countermeasure planning. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

3/2

  • IT Platform Engineer 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪29500元 以上
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16482&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that support the company’s R&D/Fab/Business/IT/Security functions to improve the productivity and work quality. Job Responsibilities: Your responsibilities include: 1. Automation and Scripting (1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. (3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows. 2. Application Development (1) Develop scalable cloud-native microservice architectures for IT applications. (2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability. (3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality. (4) Write and implement tests (unit/feature/integration) to guarantee software integrity. 3. Monitoring and Troubleshooting (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Conduct root cause analyses and apply corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Lead evaluation and adoption of new IT technologies for continuous improvement. 4. (Optional) Network Design and Management (1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test (which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
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3/2

  • 賺爆🚀iphone供應鏈【8H週休✦月賺6萬起】📣免費車位💵免無塵衣☑️週領5千✅高錄取✅電子產品組裝員⏩CD1 面試心得
  • 企業名 德萌有限公司
  • 工作地點 新竹縣竹北市
  • 薪資 月薪42240~60000元
  • 工作內容 全球最大的資訊及通訊產品 🔥上市櫃公司-五大代工廠之一🔥 🚩新竹科學園區內-iPhone供應鏈大廠📲 ✅最快隔天下夜 ✅供周領5000元 ✅靜電衣 ✅冷氣房 ✅ 8H周休二日 ✅免費員工機車停車位 ✅免經驗/高錄取 ✅附設711超商 ══ ✦ 職缺內容 ✦ ══ ❑地點 📍【竹北廠】竹北市智慧路 (竹北廠) ❑【主要產品】筆記型、桌機電腦、智慧型手機 ❑【工作內容】電子插件、組裝、包裝、SMT ❑【休息時間】用餐:40分鐘、上下午各15分鐘 ❑【休假制度】週休六日 ❑【發放薪資】每月5號發薪/可週領薪 ══ ✦時 間 / 薪 資✦ ══ ⚡ 日班 08:00-17:00 ▶️薪水:8H未加班 時薪 $215 $37,840 起~加班可達【50K】 ➜加班費最高【$288 ~ $574】 ⚡ 夜班 20:00-05:00 ▶️薪水:8H未加班時薪$240 $42,240 起~加班可達【60K】 ➜加班費最高【$321~ $641】 ➜加班費每小【$320 ~ $640】 ⭕假日加班4H以上會有交通津貼300元 ⭕國定假日都給2倍薪 ☑️每月5號發薪/可週領薪 ☑️享勞保、健保、勞退6% ☑️到職滿3個月,享有三節禮金/禮品 💎💎💎💎快速詢問💎💎💎💎 🔍+好友【𝐋𝐈𝐍𝐄🆔:@480kwlzv】 點選快速報名➠https://lin.ee/Sb13Y53 ▶ 留下資訊[姓名+電話+截圖此圖
  • 德萌有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

3/2

  • 賺爆⚡日班50K⚡夜班賺60K⚡供周領⭐8H週休二日【簡單組裝員】✅高錄取✅無經驗可CD1 面試心得
  • 企業名 德萌有限公司
  • 工作地點 新竹縣新豐鄉
  • 薪資 月薪42240~60000元
  • 工作內容 全球最大的資訊及通訊產品 🔥上市櫃公司-五大代工廠之一🔥 🚩新竹科學園區內-iPhone供應鏈大廠📲 ✅最快隔天下夜 ✅供周領5000元 ✅靜電衣 ✅冷氣房 ✅ 8H周休二日 ✅免費員工機車停車位 ✅免經驗/高錄取 ✅附設711超商 ══ ✦ 職缺內容 ✦ ══ ❑地點 📍【竹北廠】竹北市智慧路 (竹北廠) ❑【主要產品】筆記型、桌機電腦、智慧型手機 ❑【工作內容】電子插件、組裝、包裝、SMT ❑【休息時間】用餐:40分鐘、上下午各15分鐘 ❑【休假制度】週休六日 ❑【發放薪資】每月5號發薪/可週領薪 ══ ✦時 間 / 薪 資✦ ══ ⚡ 日班 08:00-17:00 ▶️薪水:8H未加班 時薪 $215 $37,840 起~加班可達【50K】 ➜加班費最高【$288 ~ $574】 ⚡ 夜班 20:00-05:00 ▶️薪水:8H未加班時薪$240 $42,240 起~加班可達【60K】 ➜加班費最高【$321~ $641】 ➜加班費每小【$320 ~ $640】 ⭕假日加班4H以上會有交通津貼300元 ⭕國定假日都給2倍薪 ☑️每月5號發薪/可週領薪 ☑️享勞保、健保、勞退6% ☑️到職滿3個月,享有三節禮金/禮品 💎💎💎💎快速詢問💎💎💎💎 🔍+好友【𝐋𝐈𝐍𝐄🆔:@480kwlzv】 點選快速報名➠https://lin.ee/Sb13Y53 ▶ 留下資訊[姓名+電話+截圖此圖
  • 德萌有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

3/2