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先進封裝製程整合工程師_南科
面試心得
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企業名
聯華電子股份有限公司
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工作地點
台南市新市區
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薪資
月薪35000~0元
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工作內容
1. Work on 2.5D/3D advanced packaging platform technologies.
2. Develop differentiated 3D stacking service and customized 2.5D interposer solutions.
3. Collaborate with internal R&D, Fab and OSAT partners to drive Heterogeneous Integration.
4. New advanced packaging process verification and qualification.
5. Customer engagement and new product verification.
聯華電子股份有限公司-使用1111轉職專區
https://central1111.com.tw/turn/