轉職找工作推薦

  • 【2026 TSMC RDSS & AO】Integrated Interconnect & Packaging Engineer (IIP) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 面議（經常性薪資達4萬元或以上）40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16568&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

  • 【2026 TSMC RDSS & AO】Process Integration Engineer (PIE) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 面議（經常性薪資達4萬元或以上）40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16570&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

  • 【2026 TSMC RDSS & AO】Process Engineer (PE) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 面議（經常性薪資達4萬元或以上）40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16571&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

  • 【2026 TSMC RDSS & AO】Equipment Engineer (EQ) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 面議（經常性薪資達4萬元或以上）40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16572&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    查看更多
    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

  • 工研院資通所_AI應用軟體開發實習生(T403) 面試心得
  • 企業名 財團法人工業技術研究院
  • 工作地點 新竹縣竹東鎮
  • 薪資 時薪200~0元
  • 工作內容 1. 協助 AI 大型語言模型（LLM）相關應用開發： 　- 熟悉並能運用雲端 LLM與本地部署開源LLM模型，根據 場景選用合適架構開發。 　- 開發 AI Agent、任務執行系統、智慧知識管理、內容生成 （生成式 AI）、對話型服務等應用。 　- 設計並實作知識搜尋、摘要、自動問答及知識庫建構等智 慧化工具。 　- 研究 LLM 結合外部工具、RAG檢索、Prompt Engineering等技術。 2. 參與專案需求討論、系統架構設計、原型驗證與效能優化 3. 對 AI 技術及應用具高度熱忱，勇於挑戰新議題，樂於與團隊共同探索 新技術 4. 配合臨時專案支援及主管交辦事項
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    • 財團法人工業技術研究院-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

  • TK+高時薪專案＄２８０【大園遠雄園區_伺服器電子組裝員】可週借支/週休二日/免經驗/免無塵
  • 企業名 艾肯國際開發股份有限公司
  • 工作地點 桃園市蘆竹區
  • 薪資 月薪70000~95000元
  • 工作內容 ―【面試找咪口✿工作就到手✿免仲介費】― ▼應徵請優先+LINE，沒問題將迅速安排您面試▼ ❣️請加LINE【@160tvqbr】或【0966463880】 ❣️加入後務必傳【職缺截圖+姓名+電話】 ❣️電話預約面試➜ 0966463880找宋小姊miko ―――――【職缺重點】――――― ✅免經驗、免學歷、免無塵衣 ✅站立為主、著靜電服、配合平假日加班 ✅免費供餐、可週借支 ⭐高時薪專案：計算期間114/12/1～115/2/28⭐ ⭐3月起恢復一般時薪(115年薪資待定) ⭐ ▶️【工作地點】：桃園市大園區航翔路(遠雄加值園區B棟) ▂▂▂▂▂【班別薪水】▂▂▂▂▂ ☀日班：08:00～17:30 ☀薪水：時薪＄２５０，月領約$44,000起 ☑配合加班月領約【７０Ｋ～８３Ｋ】依加班量 ☑加班前2小時$334/H，第3小時起$417/H - ☀夜班：20:00～05:30 (需日班實習；依狀況下夜) ☀薪水：時薪＄２８０，月領約$49,280起 ☑配合加班月領約【７９Ｋ～９５Ｋ】依加班量 ☑加班前2小時$374/H，第3小時起$467/H ―――――【職缺內容】――――― 【工作內容】：大數據伺服器生產－測試、組包裝、SMT、安檢等(流水線) 【休息時間】：用餐休90分；上下間休10分；免費供餐 【休假制度】：週休二日(六、日)；見紅休 【發薪日期】：每月10號發薪 ―――――【基本福利】――――― ❣享勞保、健保、勞退6％ ❣任職滿三個月享三節禮金或禮品
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    • 艾肯國際開發股份有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

11/13

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