台灣知名企業轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第514頁

實驗室技術員面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=442&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。說明: 1. 負責操作機台進行試片製備/分析作業(需長時間坐著操作電腦)、試片前處理、異常狀況回報。 2. 工作場所 : 穿著整套無塵服於無塵室黃光環境工作 (無塵室恆溫約21度) 3. 採四班二輪制：工作兩天，休息兩天 4. 須輪班：配合廠區跟單位調度輪調，每五個月做日夜輪調 5. 班別工作區間(含休息時間)：日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM 6. 日班總月薪約32,000元；夜班總月薪約 43,000元；另享有分紅獎金，平均年薪達75萬元以上

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

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南科電子束作業處技術員面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台南市善化區
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=440&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。說明: 1. 於無塵室內工作，需穿著整套無塵服裝(無塵室恆溫約21度) 2. 負責光罩製造機台操作、檢驗光罩品質、異常狀況回報(不會接觸化學溶液) 3. 採四輪二班制：工作兩天，休息兩天 4. 須輪班：配合廠區跟單位調度輪調，每半年做日夜輪調 5. 工作時間：每天上班12小時(含兩小時休息時間)，日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM 6. 日班總月薪約32,000元；夜班總月薪約 43,000元；另享有分紅獎金，平均年薪達75萬元以上

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

HBM Integration & Applications Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4589&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop, test, and integrate HBM solutions into products. 2. Collaborate with cross-functional teams to ensure successful integration of HBM solutions. 3. Work closely with memory vendors to develop and optimize HBM solutions. 4. Create and maintain technical documentation related to HBM integration and testing. 5. Troubleshoot and resolve issues related to HBM integration and performance. 6. Participate in the development of new products and technologies related to HBM.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

HBM Package TV Development Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4588&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop and implement test methodologies for HBM packages 2. Design and develop test hardware and software 3. Collaborate with design and product teams to ensure package designs meet specifications 4. Develop and execute test plans to validate package designs 5. Analyze test data and provide feedback to design and product teams 6. Develop and maintain test documentation and procedures 7. Participate in cross-functional teams to resolve issues and improve processes 8. Stay up-to-date with industry standards and trends

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

HBM Test Development Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=4587&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Develop and implement test plans for HBM components and systems 2. Perform testing to validate design and ensure compliance with industry standards 3. Develop test programs and scripts to automate testing processes 4. Work with cross-functional teams to identify and resolve issues 5. Analyze test data and provide recommendations for design improvements 6. Collaborate with customers to understand their requirements and provide technical support 7. Keep up-to-date with industry trends and advancements in HBM technology

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

APR Manager/ Technical Manager 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=477&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Lead APR team on tapeout projects, includes physical design and signoff 2. Responsible for advanced technology APR & 3DIC design solution research and development 3. Innovations on APR and 3DIC design domains 4. Cross sites projects coordination and management

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

Process Integration Engineer (Hsinchu) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=388&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. To be responsible for helping to drive leading edge process/device development and optimization of Flash/CMOS/RF devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. 3. Exhibit good and open communication skills, be able to work within cross-functional teams. 4. Fluent in English.

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

Intelligent Manufacturing Engineer (Hsinchu) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=322&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Overseeing the daily operations of IC foundry to ensure that all profiling operations, work flow, and customer reports are consistent with agreed upon service operations. 2. Analyze production related data and provide dynamical strategies to achieve organization production goals & KPI. 3. Assisting with scheduling projects to be completed, running projects upon compound receipt, analyzing data using database systems/tools built and updating tracking programs to keep operating smoothly. Schedule work plans in order to meet customer and business expectations. 4. Responding quickly to change priorities and handle multiple projects with potentially overlapping deadlines. 5. Contributing ideas and suggestions to improve standard techniques, protocols and processes. 6. Interacting with different functions like PE, PID and EQ to ensure robotic workstations, detection instruments, and database/informatics tools are built to meet the demands on the service. 1. 智慧製造工程師將學習領先全球之人工智慧製造技術。 2. 大數據分析、提升生產製造效率 : 透過數據分析，找出瓶頸機台，提升機台生產效率。突破性的分析派工專案系統，優化生產資源與最佳化製造效率。 3. 機器學習、創造無限可能 : 利用機器學習的研究方法，應用於生產流程改善，進而開發獨步全球的創新應用，達成生產排程的最佳化以及晶圓產出極大化。 4. 世界職涯舞台、晉升科技菁英 : 加入全球最先進的科技行列，與全球接軌，航向無限可能的未來！等待你的加入！

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

Intelligent Manufacturing Engineer (Tainan) 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點台南市善化區
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=323&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Overseeing the daily operations of IC foundry to ensure that all profiling operations, work flow, and customer reports are consistent with agreed upon service operations. 2. Analyze production related data and provide dynamical strategies to achieve organization production goals & KPI. 3. Assisting with scheduling projects to be completed, running projects upon compound receipt, analyzing data using database systems/tools built and updating tracking programs to keep operating smoothly. Schedule work plans in order to meet customer and business expectations. 4. Responding quickly to change priorities and handle multiple projects with potentially overlapping deadlines. 5. Contributing ideas and suggestions to improve standard techniques, protocols and processes. 6. Interacting with different functions like PE, PID and EQ to ensure robotic workstations, detection instruments, and database/informatics tools are built to meet the demands on the service. 1. 智慧製造工程師將學習領先全球之人工智慧製造技術。 2. 大數據分析、提升生產製造效率 : 透過數據分析，找出瓶頸機台，提升機台生產效率。突破性的分析派工專案系統，優化生產資源與最佳化製造效率。 3. 機器學習、創造無限可能 : 利用機器學習的研究方法，應用於生產流程改善，進而開發獨步全球的創新應用，達成生產排程的最佳化以及晶圓產出極大化。 4. 世界職涯舞台、晉升科技菁英 : 加入全球最先進的科技行列，與全球接軌，航向無限可能的未來！等待你的加入！

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

Quality and Reliability Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹市新竹市
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=352&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Reliability data test, analysis,and monitor. 2. New hotspot pattern and test methodology study for WAT(Wafer Acceptance Test) monitoring. 3. FAB process change management for reliability risk assessment management. 4. Circuit reliability and product reliability. 5. Customer service on reliability.

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

7/28

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