轉職找工作推薦

  • 內業工程師（大台北地區）

    交通補助年終獎金進修補助尾牙或春酒員工聚餐

  • 企業名 錦順營造股份有限公司
  • 工作地點 台北市中山區
  • 薪資 月薪50000~0元
  • 工作內容 1.處理發包估價等工程相關行政事務，合約製作管理、材料送審及文件收發檔案管理。 2.依據材料類別或承包商類別分項製作詢價標單。 3.負責業主估驗、承商計價相關作業。 4.核對整合標單與圖面。 5.管控工程採購發包及材料送審進度。 6.協助廠商估驗計價文件製作。 7.建築工程相關文件及表單建立。 8.熟悉辦公室文書作業軟體操作 AUTOCAD Excel函數及Word運用。 9.協助服務建議書、施工計畫、品質計畫、職安計畫及各工項分項計畫編排撰寫。 10.施工進度表網圖編製。 11.主管交辦事項。 以上依能力及工作負責範圍敘薪。
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    • 錦順營造股份有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

應徵
工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

  • 製圖工程師

    員工旅遊年終獎金工作獎金尾牙或春酒員工聚餐

  • 企業名 采邑光電有限公司
  • 工作地點 新北市中和區
  • 薪資 月薪40000~0元
  • 工作內容 工作技能需求： 【1】協助開發工業顯示器/工業電腦機殼之結構設計與圖面繪製。 【2】依照實品1:1相容繪製能力。 【3】使用 2D／3D 軟體製作零件圖、組立圖。 【4】圖面渲染擬真需求。 【5】管理與更新產品BOM表、圖檔與相關技術文件。 【6】與業務、內勤同仁溝通，落實產品製作細節。 【7】完成主管交辦事項。 【8】具備小客車駕照。 【9】須配合到現場量測/試安裝，與業主溝通。 【10】據相關學經歷者佳。 【11】試用期過後會有額外個人製圖獎金(論件)。 我們最重視： - 肯學習的心態：擁有願意學習、不計較的態度，是我們最看重的特質！ - 歡迎加入：我們非常期待你能成為團隊的一份子，共同打拼、成長。 注意事項： - 工作繁忙，有意者請直接投遞履歷，請勿來電洽詢，謝謝您的理解！
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    • 采邑光電有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

  • 不動產租賃開發高專人員/百萬年薪不是夢/抽成高
  • 企業名 尚昱物業管理顧問有限公司
  • 工作地點 新北市新莊區
  • 薪資 月薪40000~0元
  • 工作內容 1. 負責房屋租賃業務，包括市場調研、租賃開發及客戶需求諮詢。 2. 執行不動產代管作業，統籌房源維護與租金管理，定期回報業主。 3. 提供專業買賣仲介服務，進行市場評估，完善交易文件及流程。 4. 針對商用不動產進行資產評估，參與高階商務協商與簽約談判。 5. 定期拜訪潛在客戶，協助建立房東房客良好互動與長期關係。 6. 維護社區及商圈關係，分析市場資訊以擴大潛在商機。 7. 進行不動產現勘及檢驗，完成屋況評估、價值分析及建議改善方案。 8. 支援主管專案執行，準備資料報告並協助企業策略推動。 目前誠徵高獎金業務專員(適合:肯學習，需彈性工作時數，想達到高獎金的您!!!) 我們目前從事各類不動產住宅/店面/商用 、代管、租賃及買賣相關業務的公司， 您的居住地台北市區或新北範圍皆可 工作時間彈性，無硬性上下班規定的時間，僅需自備交通工具。 工作內容簡單，公司單純。 若無業務開發經驗者，提供您完整業務開發/銷售教育課程及學習機會
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    • 尚昱物業管理顧問有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

  • 圈粉忠孝店｜一般正職人員｜捷運市府站 面試心得
  • 企業名 海底撈火鍋股份有限公司
  • 工作地點 台北市信義區
  • 薪資 月薪40000~0元
  • 工作內容 ⭐️酸辣粉新品牌｜開店夥伴招募中！ ★工作時間：圈粉鋪子-台北市信義區忠孝東路43號1樓(捷運市政府站4號出口) ★工作時間： 早班09:00-18:00或晚班13:00-22:00，空班1小時。 ★工作內容： 1.食材清洗、備料與簡易烹煮。 2.出餐、包裝與品質確認。 3.協助點餐、結帳與清潔。 4.完成主管交辦事項。 ★薪資福利： 月薪40,000元起，享員工消費折扣、定期健康檢查福利。
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    • 海底撈火鍋股份有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

  • 【2026 TSMC RDSS & AO】Intelligent Manufacturing Engineer (IMC/MFG) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16573&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer 2. CIM Intelligent Manufacturing Engineer 3. Data Analyst & Data Scientist 4. AMHS (Automated Material Handling System) Engineer 5. PIDS/WAT (Wafer Acceptance Test) Engineer 6. PIDS/NTO (New TapeOut) Engineer 7. Quality Management Engineer Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    查看更多
    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

  • 【2026 TSMC RDSS & AO】Facility Engineer (FAC) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16574&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 4. Construction management & project coordination. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    查看更多
    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

  • 【2026 TSMC RDSS & AO】Product Engineer (PE) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    查看更多
    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

  • 【2026 TSMC RDSS & AO】Advanced Packaging Technology and Service Engineer (APTS) 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪40000~0元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    查看更多
    • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

應徵
工作適配度－%

登入 後即可查看

根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

12/22

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