台灣月薪轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第27217頁

多媒體數位IC設計工程師面試心得
企業名聯發科技股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 1. RTL設計 2. 數位電路設計 3. 數位多媒體系統設計 4. SOC整合 5. 系統匯流排架構設計

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/8

VSOC 整合工程助理 (約聘) 面試心得
企業名聯發科技股份有限公司
工作地點台北市內湖區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 0. 基本英文文書能力 1. Responsible for establishing and improving software engineering relevant systems and automation mechanism 2. Responsible for improving software configuration management systems 3. Responsible for improving release automation systems 4. Responsible for improving Linux build environment

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工作適配度－%

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5/8

AI SDK/IDE Software Engineer 面試心得
企業名聯發科技股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 At MediaTek, we are at the forefront of enabling device + cloud hybrid architectures for generative AI. On-device AI offers significant advantages, including low latency, enhanced security, privacy, and personalization through fine-tuning to meet specific user needs. As an AI SDK/IDE Software Engineer, you will be responsible for developing and enhancing our NeuroPilot SDK workflow. This role involves designing and implementing features that support neural network development stages, including network conversion, optimization tuning, profiling and accuracy analysis. You will work closely with cross-functional teams to ensure a seamless user experience and robust functionality. We are seeking talented individuals to join our team and contribute to this cutting-edge field.

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工作適配度－%

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5/8

＜Data center＞數位設計 AI 開發工程師面試心得
企業名聯發科技股份有限公司
工作地點新竹縣竹北市
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容我們正在招募一位熟悉生成式AI技術且擅長前端數位設計的工程師。本職缺專注於運用前沿商業或開源 LLM，於RTL設計、RTL優化、simulation testbench生成、formal testbench 生成等數位設計流程，開發提升設計自動化與效率之 AI 演算法。您將與RTL設計工程師、DV驗證工程師與AI專家合作，共同推動數位設計智能化。另外, 您也會研讀期刊,開發並評估效果, 並撰寫技術文件,專利或paper投稿.

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工作適配度－%

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5/8

＜Data Center＞Senior/Lead DFT CAD and Methodology Engineer 面試心得
企業名聯發科技股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 We are looking for a highly skilled DFT CAD and Methodology Expert to develop and deploy advanced test methodologies for next-generation data center and AI ASIC. Enhancing the efficiency and quality of our ASIC development and testing procedures. The successful candidate will work within the CAD team to innovate test solutions for complex 2.5D/3DIC, ensuring high quality and yield for advanced packaging technologies. Key Responsibilities • Methodology Development: Develop and deploy robust CAD flows for scan insertion, ATPG, pattern simulation, and Memory BIST (MBIST). • Tool Automation: Create scripts (Python, TCL, Perl) to enhance and automate DFT flows, accelerating simulation runtimes and improving quality of results (QOR). • EDA Tool Integration: Collaborate with EDA vendors to enhance tools for advanced packaging, including test verification and pattern generation. • Support & Debug: Support DFT integration teams with CAD flow issues, debug complex issues, and provide technical mentorship. • 3DIC/2.5D Expertise: Develop and implement testing strategies for chiplets and TSV-based 3D stacks. • Location: Hsinchu, Taipei, Singapore.

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工作適配度－%

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5/8

＜Data Center＞DFT Architect for Data Center ASIC products 面試心得
企業名聯發科技股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 We are looking for candidates that can communicate complex engineering subjects effectively to cross functioning technical teams and upper management. Strong DFT and leadership skills will be put to good use. Successful DFT architects interact with many external teams and must confidently represent his/her organization. Key Responsibilities • Drive DFT Excellence: Define DFT architecture specifications that enhance ATE and production test environments, optimize test costs, and improve quality across future MTK ASIC product portfolios. • End-to-End DFT Leadership: Manage comprehensive DFT activities spanning architecture definition, design implementation, verification, and test deployment for new product launches • Manufacturing Integration: Serve as a key contributor within MTK’s Global Quality and Operations organization to deliver optimal manufacturing test solutions from early product conception through post-silicon validation • Design Collaboration & Quality Assurance: Partner closely with design teams to ensure accurate implementation of DFT structures and compliance with specifications • Cross-Functional Team Coordination: Lead internal DFT teams in developing and implementing robust test solutions aligned with architectural requirements • Yield Optimization Strategy: Develop comprehensive plans for diagnosability enhancement and systematic yield improvement • Location: Hsinchu, Taipei, Singapore, USA

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應徵

工作適配度－%

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5/8

＜Data center＞AI Engineer for Autonomous IC Design Flow 面試心得
企業名聯發科技股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容我們正在重新定義晶片設計的未來，不再僅僅是設計電路，而是打造一個能夠「自我演化」的晶片設計大腦。我們正在招募具備 IC 設計與 AI 技術熱忱的工程好手，一起開創 IC 設計新時代！您將與跨領域專家攜手打造 IC Design Autonomous 的未來——運用最先進的 GAI 技術，實現從規格生成、RTL 編碼到自動化 QC 錯誤清除的完整 IC 生命週期自動化，並建立自我進化的生產力循環，讓 AI 真正落地於 IC 設計流程！ *任務描述 - 全流程自動化：設計並實作端到端的自主設計代理人 (Agentic AI) 框架，涵蓋 Spec-to-RTL 與自動化 QC 修復 - 架構演進：利用 GAI 技術進行 PPA (Power, Performance, Area) 優化，開發具備自我回饋、自我學習能力的設計閉環 - 技術領導：指導跨團隊協作，將 IC 設計流程中的自動化瓶頸，轉化為 AI 可理解並自主執行的架構 - 知識體系建構：構建領域專屬的 Knowledge Base 與 Multi-Agent 協作框架 - 研究創新：研讀最新技術、發表專利論文，將前沿研究轉化為實際應用

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工作適配度－%

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5/8

＜Automotive＞Senior Automotive SoC System Architect or Manager 面試心得
企業名聯發科技股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 * Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification. * (If manager) Manage the design architecture team, focusing on both technological advancement and talent development.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/8

＜Automotive＞Automotive SoC System Architect 面試心得
企業名聯發科技股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 * Lead specific architectural domains for SoC architecture design and product technical feasibility studies (e.g., AI, ISP, heterogeneous computing, memory, interconnect, power, safety, vehicle E/E, in-vehicle network). * Lead or support automotive SoC architecture, focusing on system performance and power based on product requirements. * Lead or support technical feasibility studies of product requirements; collaborate with domain architects and product marketing to develop competitive product design specification.

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/8

半日蔬菜理貨人員
員工旅遊供餐福利進修補助員工聚餐
企業名懷石餐飲股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 1.簡易文書 2.蔬菜截切作業 3.蔬菜級數分類入庫 4.蔬菜整理分類出貨 5.作業完成.環境清潔

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/8

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