台灣薪資40000起轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第608頁

(Germany) Sr. Field Application Engineer – Automotive Ethernet
企業名瑞昱半導體股份有限公司
工作地點中歐德國
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容 1. Summary Realtek Semiconductor Corp., located in the Hsinchu Science-based Industrial Park, Taiwan‘s 〝Silicon Valley〝, established in 1987. Realtek‘s efforts to provide the ultimate in pioneering IC technology — along with its firm commitment to creating unique and innovative designs for a broad range of high-tech applications — have won the company a worldwide reputation and made possible a favorable and consistent growth rate in the years since its establishment. In line with the Realtek culture of 〝Self-confidence and trust in people〝, we believe that we can achieve our best, and trust our colleagues can also do the same. Working and learning in Realtek, we openly share knowledge and experience with one another to inspire innovation and pursue growth of the company, as well the individuals. Talent is the important capital of Realtek. Welcome to Join Realtek Family! 2. Essential Job Functions ‧Locate in Southern part of Germany (Frankfurt to Stuttgart, or Stuttgart to Munich) ‧Provide pre-sales and post-sales support. ‧Understand customer requirements, and deliver technical presentations, reports, documents and technology demonstrations. ‧Support customer product development and design. ‧Support customer issue analysis and resolve. ‧On-site support for debug or certification test. ‧Cross-functional collaboration with Realtek internal resources. 3. Education, Skills, Abilities, And Experience Required ‧M.S. or B.S. in Engineering or equivalent. ‧3 to 5 years of progressive professional technical experience in IC design or related areas, direct experience in IC design house FAE is preferred. ‧Strong analytical and problem solving skills. ‧Strong written/verbal communication and negotiation skills. ‧Being proactive and willing to take initiatives. ‧Ability to work independently to achieve goals. ‧Ability to understand and explain technical issues and solutions to technical and non-technical personnel. ‧Native German skill. ‧Medium or higher English skill. ‧Familiar with Ethernet protocols will be a plus. ‧Familiar with Automotive ecosystem will be a plus. ‧Basic or higher Chinese skill will be a plus. ‧Experience of Linux system will be a plus. 4. Industry Automotive Ethernet, Semiconductor 5. Employment Type Full-time 6. Job Functions Engineering, Business Development

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工作適配度－%

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6/25

藍牙韌體設計工程師C1
企業名瑞昱半導體股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： 1. Bluetooth SoC Firmware Development. 2. FPGA/ASIC Verification. 3. Customer Support. 應徵條件： 1. 碩士以上；電機、電機與控制、資訊科學、自動控制、通訊工程、電信、資訊工程、電子相關科系畢業為主。 2. 有 RTOS 相關開發經驗。 3. 精通 ARM / MIPS assembly, C or C++ programming language。 4. 積極, 自我挑戰, 善協調, 有創造力。 5. 需出差協助客戶解決問題。

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工作適配度－%

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monitor/translator客戶技術支援工程師
企業名瑞昱半導體股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： Monitor/translator韌體開發，客戶問題解決。應徵條件： 1. 碩士以上;電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、動力機械、自動控制、通訊工程相關科系畢業為主。 2. 熟悉 C語言,　C++。 3. 熟悉 MCU, orcad。

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工作適配度－%

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Monitor應用工程師
企業名瑞昱半導體股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目：韌體撰寫及解決客戶問題應徵條件： 1. 碩士以上;電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、動力機械、自動控制、通訊工程相關科系畢業為主 2. 熟悉 C語言 3. 熟悉 Orcad

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高效能運算(HPC)實體設計資深工程師(台南)T2
企業名瑞昱半導體股份有限公司
工作地點台南市新市區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： 1. CPU & GPU Backend Implementation (APR) 2. CPU/GPU Backend Flow Development, Enhancement & Automation 3. Advanced CPU/GPU Technology Development: High-performance, Low Power, and PPA Optimization 應徵條件： 1. 碩士以上；電機、資工、電子相關科系畢業為主。 2. 熟悉 APR Tools (Innovus、ICC2、Fusion Compiler…)，有Synthesis、STA/IR Analysis、Physical Verification等相關經驗者佳。 3. 具備程式設計能力，熟悉 TCL/Perl/C++/Python。 4. 有 High Performance CPU/GPU APR經驗尤佳。 5. 個性積極負責、勇於迎接新挑戰，對於 High-Performance CPU/GPU Technology 有興趣者。

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高效能運算(HPC)前端設計資深工程師(台南)T2
企業名瑞昱半導體股份有限公司
工作地點台南市新市區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： 1.High-Performance CPU & GPU & Armv9 & Server-class Compute SubSystem (CSS) Frontend Implementation (including STD cells/SRAM analysis & selection, DFT insertion, Synthesis, low power cells insertion & verification) 2.Advanced ASIC Implementation Flow Development & Automation: High-performance, Low Power, and PPA (Performance, Power, Area) Optimization 3.Physical Synthesis and Collaboration with P&R in Timing/Congestion Analysis and PPA Optimization 4.Perform Power Replay and Power Analysis 5.Perform Pre-layout/Post-layout Quality Checks (including LEC, CLP, ATPG, GCA, PPA quality) 應徵條件： 1.碩士以上；電機、電機與控制、資訊工程、電子相關科系畢業為主。 2.熟悉 Frontend EDA Tools、Synthesis、Timing Analysis、Low Power Implementation Flow & PPA (Performance, Power, Area) Optimization。 3.有開發Automation Flow的經驗，熟悉 TCL/Perl/Python。 4.英文能力良好，聽說讀寫精通。 5.有 CPU、GPU、Multi-Core Processor、Compute SubSystem Implementation 經驗尤佳，例如 Synthesis/Floorplan/CLP/DFT等。 6.積極負責、勇於迎接挑戰，對於 High-Performance CPU/GPU/CSS、Advanced PPA Optimization、Energy Efficiency Technology 有興趣者。

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工作適配度－%

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6/25

高效能運算(HPC)設計技術資深工程師(台南)T2
企業名瑞昱半導體股份有限公司
工作地點台南市新市區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： 1. ARM Architecture based Complex CPU Subsystem Platform Design & Integration, Add-on Features Enablement and IP Development 2. SoC Architecture Exploration, Performance Projection and Bottleneck Analysis 3. Benchmark/Power Characterization on Emulation Platform, Result Analysis and Optimization 4. CPU Architecture/Micro-architecture Research 5. Involvement of Post-silicon Bring-up and Debug 應徵條件： 1.碩士以上；電機、資工、電子相關科系畢業為主。 2.具IP開發經驗，熟悉 SoC Integration & Design Flow、Frontend Timing/Power Analysis EDA Tools。 3.熟悉ARMv7/v8-A CPU 架構及AMBA protocol，有 ARM Cortex-A CPU/Subsystem Design/Integration/PPA Optimization/Sign-off 經驗尤佳。 4.具Emulation platform (Zebu, Palladium)經驗尤佳。 5.有 Low Power Design & Verification、Post-Silicon Validation & Debug 經驗尤佳。 6.積極負責、溝通協調能力強、勇於迎接挑戰，對於 High-Performance CPU Technology 有興趣者。

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資深數位IC驗證工程師C4(台南)
企業名瑞昱半導體股份有限公司
工作地點台南市新市區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： 1. 開發維護 in-house VIP 2. 支援產品線 IC 驗證計劃工作地點：台南科學園區應徵條件： 1. 大學、碩士以上；電機、電機與控制、資訊科學、自動控制、通訊工程、電信、資訊工程、電子、動力機械相關科系畢業為主。 2. 熟悉 SystemVerilog 驗證語言和 perl 相關 scripts。 3. 熟悉 UVM 或 VMM methodology 。 4. 熟悉 PCIE/USB/SATA 等 protocol 。 5. 具4年以上 IC 驗證相關經驗。 6. 有 VIP 開發經驗者尤佳。

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北美線國際行銷客戶經理
企業名瑞昱半導體股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： 1. Lead and manage all Realtek‘s commercial activities including engaging in various stages of the sales cycle, setting up account strategy, executing the account plan, developing multi-level customer relationship across functions of product planning, procurement and senior management, to meet or exceed annual and quarterly revenue and design targets, along with business objectives. 2. Identify the key solution and product requirement from project development and design win perspective and promote Realtek‘s solution advantage. 3. Clearly articulate customer needs, along with industry trends to sales management and Realtek product lines. 4. Understand the competitive landscape, obtain feedback and work with PMs/engineering teams to provide our offerings to customers. 5. Focus customers from various market segments: IOT, Distributor&Sales Representative, Automotive, Home Networking. 6. Legal Agreement Handling such as NDA, Purchasing Agreement and MOU. 應徵條件： 1. BS in engineering or business required, advanced degree (i.e.) MBA/MS desired. 2. 5-10 years of strategic account(OEM/ODM/Telco/MSO) sales experience in semiconductor or RF/networking/carrier industry, specifically managing foreign accounts. 3. Must be fluent in written and spoken English & Chinese. 4. Multi-cultural experience is desirable. 5. Must demonstrate ability to address multiple product lines and product segments. 6. Experience and knowledge of key account inner organization to work with the influencers, blockers, and decision makers. 7. Ability to present a compelling business case to internal and external. 8. Great Interpersonal Skill and Ability to work cross departments and product groups.

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工作適配度－%

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6/25

數位IC設計資深工程師P2
企業名瑞昱半導體股份有限公司
工作地點新竹市東區
薪資面議（經常性薪資達4萬元或以上）40000~40000元
工作內容工作項目： 1. Maintain並開發 USB3、USB4與 PCIe之 DPHY/MAC相關 design. 2. 整合 USB3、USB4、PCIe等 SerDes PHY與 MAC. 應徵條件： 1. 熟悉 USB3.2、PCIe、PIPE4/5等 Spec. 2. 具 USB3.2 or PCIe Gen3/Gen4 DPHY/MAC設計經驗。 3. 具 USB3.2 or PCIe Gen3/Gen4等 PHY IP整合經驗。 4. 具備 SoC晶片整合能力。

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

6/25

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