轉職找工作推薦

  • 台北市松山區社區總幹事

  • 企業名 洪英特勤保全股份有限公司
  • 工作地點 台北市松山區
  • 薪資 月薪46000元 以上
  • 工作內容 1.落實執行社區規約及管理辦法 2.召開會議並準備相關會議資料 3.執行會議決議事項與追蹤進度 4.審核社區財報並規劃財務預算 5.管制修繕事項並監控施工品質 6.確保社區服務品質並推動維護措施 7.運用電腦軟件執行行政及管理作業
  • 洪英特勤保全股份有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
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工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

  • 新店區社區總幹事

  • 企業名 洪英特勤保全股份有限公司
  • 工作地點 新北市新店區
  • 薪資 月薪50000元 以上
  • 工作內容 1.落實執行社區規約及管理辦法 2.召開會議並準備相關會議資料 3.審核財務報表及進行預算規劃 4.規劃並審核社區管理維修辦法 5.熟悉保全及樓宇管理相關法規 6.運用電腦軟件及管理系統記錄資料 7.推動社區行政、清潔及警衛服務工作
  • 洪英特勤保全股份有限公司-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

  • 會計

  • 企業名 台灣地景花園
  • 工作地點 桃園市中壢區
  • 薪資 月薪40000~50000元
  • 工作內容 收售票、簡易帳務處理、服務遊客
  • 台灣地景花園-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

  • R&D IIP Simulation Engineer 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪40000~50000元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16521&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking a highly motivated and talented R&D Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis. Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions. Responsibilities: 1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements. 2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs. 3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

  • 【AI數位金融】創新數位產品主管 面試心得
  • 企業名 遠東國際商業銀行
  • 工作地點 台北市信義區
  • 薪資 月薪40000~50000元
  • 工作內容 我們正在尋找一位熱情、富有創新思維的金融業專業人士,帶領我們的創新產品團隊,打造下一個創新金融革命! ________________________________________ 【職務說明】 創新產品主管負責領導團隊從概念到落地的全產品週期,包含產品策略、設計、開發、上市推動與績效管理,並與跨部門及合作夥伴緊密合作,共同開創新一代數位金融產品,將創意落地實現轉化為實際業績收益。 ________________________________________ 【工作內容】 • 主導創新產品的開發、規劃與管理,確保創意從概念到落地的全流程,並提供具體的作品案例佐證成果。 • 帶領團隊提出創新產品方案,並將所有創意最終轉化為具體的業績績效。 • 擔任跨業合作的專案領導者,統籌內外部資源,主導跨業合作專案,並整合異業夥伴資源共創價值。 • 結合市場趨勢、用戶需求與科技創新,提出具突破性的數位金融產品策略。 • 跨部門協作,整合業務、風控、法遵及技術資源,確保產品成功上市並達成業績指標。
  • 遠東國際商業銀行-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

  • 【AI數位金融】防詐科技應用組主管 面試心得
  • 企業名 遠東國際商業銀行
  • 工作地點 台北市大安區
  • 薪資 月薪40000~50000元
  • 工作內容 【關於團隊】 AI數位金融事業群 - <AI 應用發展部> 是一個結合創新與技術的前沿團隊,充滿挑戰自我與突破現狀的熱情。我們專注於應用人工智慧技術,為遠銀內部提供AI人機協作解決方案,致力於解決業務及流程痛點以提升效能提升。團隊擁有協作共享的文化,鼓勵創意與實驗,您將有機會參與從0到1的AI應用導入專案,感受成果落地的成就感。部門採用靈活混合辦公模式,讓您在平衡生活與工作的同時,與遠銀共同持續探索AI發展的無限可能。 【職責內容】 1.設計並導入防詐系統,包括反詐欺平台、機器學習模型及大數據分析工具。 2.利用 AI 及機器學習技術,提升自動化風險判斷能力,並針對異常交易即時偵測與應變。 3.配合主管機關執行防詐相關業務,包含資料提供、專案配合及議題交流等事宜。 4.進行跨部門協作,規劃與推動防詐措施相關專案。 5.追蹤國內外最新防詐技術趨勢並提出創新應用方案。
  • 遠東國際商業銀行-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

  • IT Infrastructure Engineer 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪40000~45000元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=555&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking outstanding engineers to join TSMC IT infrastructure team to build and operate IT advanced Data Center to support world-class semiconductor foundry. This team is responsible for designing, implementing and optimizing IT infrastructure towards software-defined computing, storage and networking with advanced cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Job Responsibilities: Your responsibilities include: 1. Network/Storage Design and Management: (1) Design, construction, operation, and capacity planning of large-scale NAS storage/object storage. (2) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (3) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. 2. Automation and Scripting: (1) Develop and maintain automation scripts for network configuration, monitoring, and management using tools like Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. 3. Application Development: (1) Develop state-of-the-art applications and refactor existing applications for improved performance and maintainability. (2) Write and implement tests (unit/feature/integration) to guarantee software integrity. 4. Monitoring and Troubleshooting: (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Perform root cause analysis and corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Infrastructure operation issues(network/server/storage/security) visualization and countermeasure planning. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months 1. Manager interview 2. Hackerrank test 3. On-site personality and English test(which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

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根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15

  • IT Platform Engineer 面試心得
  • 企業名 台灣積體電路製造股份有限公司(台積電)
  • 工作地點 新竹縣寶山鄉
  • 薪資 月薪40000~45000元
  • 工作內容 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16482&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that support the company’s R&D/Fab/Business/IT/Security functions to improve the productivity and work quality. Job Responsibilities: Your responsibilities include: 1. Automation and Scripting (1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. (3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows. 2. Application Development (1) Develop scalable cloud-native microservice architectures for IT applications. (2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability. (3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality. (4) Write and implement tests (unit/feature/integration) to guarantee software integrity. 3. Monitoring and Troubleshooting (1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Conduct root cause analyses and apply corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Lead evaluation and adoption of new IT technologies for continuous improvement. 4. (Optional) Network Design and Management (1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy. (2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only) On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview 2. Hackerrank test 3. On-site personality and English test (which could be replaced if you have script of an official English test) 4. HR interview 5. Second manager interview (Optional assessment) 6. Technical review (Optional assessment) Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
  • 台灣積體電路製造股份有限公司(台積電)-使用1111轉職專區 https://central1111.com.tw/turn/
應徵
工作適配度%

登入 後即可查看

根據履歷表的填寫狀況,智慧分析您與工作的適配程度。

4/15