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3DIC Advance Package Design Engineer
面試心得
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企業名
聯發科技股份有限公司
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工作地點
新竹市東區
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薪資
月薪37500~39500元
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工作內容
10+ years experiences in IC Advance Package Design such as 3DIC Development, ASIC (APR) design, flow development, and EDA enablement KEY RESPONSIBILITIES: 1. Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design.
2. Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance.
3. Support package design teams in defining a tool roadmap for advanced package design.
4. Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility.
5. Represent the Package design team in customer engagements for advanced package designs.
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