台灣轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第9410頁

[學期實習生] Kaohsiung - Process Engineer Intern (Wire Bonding)
企業名台灣恩智浦半導體股份有限公司 (NXP Semiconductors Taiwan Ltd)
工作地點高雄市楠梓區
薪資月薪36000~0元
工作內容 ***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

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工作適配度－%

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Hsinchu - APAC Foundry Operations Senior Principal Engineer
企業名台灣恩智浦半導體股份有限公司 (NXP Semiconductors Taiwan Ltd)
工作地點新竹市東區
薪資月薪36000~0元
工作內容 Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

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Hsinchu - Tape Out Engineer
企業名台灣恩智浦半導體股份有限公司 (NXP Semiconductors Taiwan Ltd)
工作地點新竹縣竹北市
薪資月薪36000~0元
工作內容 Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

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工作適配度－%

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倉管人員
企業名瑋禮企業股份有限公司
工作地點台中市西屯區
薪資月薪32000~0元
工作內容 1. 負責管理倉庫物品和物料的進出，核對相關單據，確保記錄準確無誤。 2. 定期清點庫存，標示和正確放置物料，必要時對相關人員解說，使其容易使用。 3. 處理貨品的輸送、包裝和發放作業，並申請補充不足的存貨物品。 4. 負責物料的接收、檢驗與分類作業，確保符合標準與需求。 5. 熟悉庫存管理系統操作，定期追蹤和複查庫存紀錄，找出不符原因並改善。 6. 與生產部門及其他相關部門協調合作，確保物料按時供應及物流流程順暢。 7. 熟悉專用生產機械零件及材料管理，了解機械製造流程及基本機械知識。

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工作適配度－%

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執行長助理
員工旅遊年終獎金進修補助工作獎金下午茶員工聚餐定期調薪
企業名亞冠國際旅行社有限公司
工作地點台南市中西區
薪資月薪29500~0元
工作內容 1. 協助執行長處理各項行政事務，包括文件處理、日程管理以及會議記錄等。 2. 負責安排執行長的商務行程及出差，包括預訂機票、住宿及相關交通安排。 3. 協助組織與追蹤專案進度，確保各項專案如期完成。 4. 熟練使用辦公軟體（如 Excel、Word、PowerPoint），撰寫報告及製作簡報內容。 5. 進行市場調查及競爭分析，整理並提供有價值的數據及建議。 6. 協助執行長進行內部及外部溝通協調，維繫良好的客戶關係，並處理客訴問題。 7. 熟悉旅遊產業流程，協助簽證辦理及行前準備指導等相關事務。歡迎加入我們，一起打造高效能、充滿熱忱的工作團隊！立即投遞履歷，期待您的加入！

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Principal Process Integration Engineer
企業名台灣恩智浦半導體股份有限公司 (NXP Semiconductors Taiwan Ltd)
工作地點新竹市東區
薪資月薪29500~0元
工作內容 Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Principal-Process-Integration-Engineer_R-10063266 Job Description 【Why This Role?】 Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below). 【Key Responsibilities】 Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer. 【Required Qualifications】 Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics. 【Preferred Skills】 Process Transfer Expertise: Successful track record in 〝Copy-Smart〝 process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design. 【Soft Qualities】 Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.

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工作適配度－%

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倉儲理貨員
企業名天天冷凍股份有限公司
工作地點新北市中和區
薪資月薪42000~52000元
工作內容 1.冷凍庫作業 (入貨、出貨、儲位整理、開單、盤點)。 2.堆高機操作。 3.拆櫃、裝櫃。 4.需輪班，可配合加班。 5.協助客戶進出貨事宜。 6.工作環境清潔及維謢。 7.冷凍機具及設備基礎維護及保養。 8.其他主管交辦事項。

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工作適配度－%

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急徵-泰山工地日班人員
企業名雄衛物業管理顧問有限公司
工作地點新北市泰山區
薪資月薪42000~0元
工作內容 1. 負責車輛的車身清洗、車內清潔、拋光打蠟、玻璃護理以及輪胎保養工作，確保車輛外觀與內部整潔。 2. 熟練操作汽車美容相關產品，具備一定的汽車美容產品知識及環保清潔知識，進行安全操作。 3. 執行建築物及周遭環境的巡邏，確保門窗安全，密切監控可疑活動，維護施工現場安全。 4. 管理出入口人員及訪客登記，執行嚴格的出入管制，確保施工現場秩序良好。 5. 負責監看監視器畫面，回應警報器報警並進行深入調查，處理任何不良行為或潛在威脅。 6. 協助實施基礎設施維護工作，監督施工現場設備的清潔與維護，協調維修事宜。 7. 準備並提交相關事件和安保作業報告，確保施工現場事件有完整記錄，並與相關單位進行協調。歡迎加入我們的團隊，共創安全與高效的工作環境，期待您的加入！立即投遞履歷吧！

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工作適配度－%

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6/29

【路科大量徵才】報到獎金加碼到42k😎,可自選班別,夜校生可面試心得
年終獎金工作獎金尾牙或春酒
企業名 1111人才獵聘管理中心
工作地點高雄市路竹區
薪資月薪33500~55000元
工作內容意者可截圖加line詢問詹小姐 👉👉 Line ID: @wvn5914k ☎️電話0982-251-111 ➡️ 按下「我要應徵」，將有專人與您聯繫 🎊加碼獎金看這邊：方案日期：115.6.8 - 115.7.31 💖方案內容：＜1＞到職新人享留任獎金最多第一個月5000元、第二個月3000元、第三個月4000元，共12000元＜2＞路竹廠加碼新人簽約金 1️⃣早班/中班第一個月5000元、第二個月5000元、第三個月5000元，共15000元 2️⃣大夜班第一個月10000元、第二個月1000元、第三個月10000元，共30000元 3️⃣路竹廠任職滿一年考核B級以上獎金最多3萬元 1獎金併同薪資發放且發放日需在職 2.實際依公司考核規定發放,需達到出勤90％ 3.須配合公司每月報到梯次路竹廠享介紹獎金：被介紹人任職滿月介紹人享1萬，被介紹人任職滿三個月享1萬 ⏳上班時間 (可自選班別；休息時間比照法規輪流休息) 8小時制(做三休一+做二休一 ) 早班/ 33500元（含加班可達38~42k）中班/ 38780元（含加班可達45~47K）夜班/ 41200元（含加班可達49~51k） ⚙️工作內容： 1、機台操作 2、品檢（顯微鏡）產品檢查 3、組裝被動電子元件 4、原物料上、下料 5、穿著半套or全套無塵服（看部門站點）福利介紹 1.生日禮券 2.三節禮券/禮品 3.婚喪喜慶補助 4.生育補助 5.福利活動:福委會活動、員工家庭日、餐券、電影票.......等等 6.駐廠醫生免費諮詢 7.視障按摩 8.員工免費團保 9.員工國內外旅遊 10.特約商店 11.年終績效獎金 1-3個月

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工作適配度－%

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倉管行政助理
企業名天天冷凍股份有限公司
工作地點新北市中和區
薪資月薪33000~36000元
工作內容 1. 進、出貨單資料建檔及輸入。 2. 進、出貨之連絡及傳達訊息。 3. 協助拆櫃數量統計及製表。 4. 庫存核對、庫存盤點、資料彙整。 5. 獎金計算。 6. 電腦文書。 7. 環境清潔整理及維謢。 8. 郵局寄信及採買庶務用品。 9. 主管交辦事項。

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

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