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技術工程類-研發工程師(記憶體封裝)
面試心得
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企業名
力成科技股份有限公司
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工作地點
新竹縣湖口鄉
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薪資
月薪45000~60000元
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工作內容
A. Package design
1. Package RFQ for cost estimation
2. New device package feasibility & technical risk assessment
3. Package structure, BOM design
4. Package design rule setup & update
5. Coordinate DR0 design review meeting
6. PKG structure confirmation after setup
B. Package research & development
1. Research & setup package roadmap / material roadmap
2. New package development
3. New material survey & capability development
4. Setup direct material purchase specification
5. Technical benchmark with competitors (Reverse engineering)
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https://central1111.com.tw/turn/