新竹縣寶山鄉轉職工作機會，轉職跳槽推薦工作，提供履歷健診等強化服務|1111轉職專區-第5頁

【2024 Campus Recruitment】TSMC Human Resources Specialist 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪38700~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4293&source=1111&tags=2024DomesticCampus_1111 Description: 【HR Area Service Specialist】 1. Partner with hiring managers to identify recruiting needs, best-fit candidates through TSMC selection process, prepare employment proposal, influence hiring manager and candidate to close the offer and facilitate the onboarding. 2. Build and maintain strong relationships with candidates, hiring managers and business partners/AST from end to end. 3. Maintain hiring progress and generate reports to monitor KPIs/quality. 【Talent Selection Specialist】 1. Manage the overall recruitment process by partnering with hiring managers and HR business partners to identify recruiting needs, assess best-fit candidates through TSMC‘s selection process, prepare employment proposals, close offers and facilitate the onboarding process. 2. Build and maintain strong relationships with candidates, hiring managers and HR business partners to ensure successful fulfillment of job openings. 3. Monitor recruitment progress/hiring quality and identify potential issues by generating and analyzing reports and KPIs. Qualifications: Personal Attributes 1. Integrity and commitment to results 2. Highly motivated to take initiatives for continuous improvement with great follow-through skills 3. Strong team player to fill gaps whenever necessary 4. Great resilience to cope with challenges, stress, and fast-paced environment Other Requirements 1. Master‘s degree in HR, Psychology or Business Management related fields 2. Strong verbal and written communication skills and good command of English and Mandarin 3. Multitasking abilities to manage complexity and dynamic demands 4. Strong self-learning capabilities to acquire skills in online systems, processes and semiconductor technical knowledge 5. Ability to analyze & visualize data

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC Quality & Reliability Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪38700~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4290&source=1111&tags=2024DomesticCampus_1111 Description: 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis, manufacturing production quality management and reliability assessment, research, and development of new analysis protocol. 3. Customers problem resolving for production quality / reliability issues. Qualifications: 1. Master‘s degree or above in electrical engineering, materials science, chemistry, physics, mechanical engineering or related science and engineering areas. 2. Statistics or machine learning background for data analysis and statistics development & application related roles.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC Module Associate Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪38700~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4288&source=1111&tags=2024DomesticCampus_1111 Description: Task: 1. 你喜歡動手解決精密機械、設備問題嗎？ 2. 你想要突破半導體機台量產技術的極限，並持續挑戰未來科技的無限可能嗎？ 3. 〝模組副工程師〝就是最適合你的位置，你將運用最先進的操作系統及AI人工智慧界面來進行設備維修、保養，與公司一起成長，共同突破機台的生產極限，成為推動半導體領域解決問題的工程專業人才！ Job Content: 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性 4. 需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天) 5. 加入TSMC ,訓練成為模組副工程師後, 您將享有: A. 挑戰百萬年薪: (1) 高競爭力的薪資水準及獎酬機制 (2) 夜班獎金：每月輪值大夜班一次(六天)除夜班津貼外，另發放鼓勵獎金NT$8,000，每月輪值均能領取，等於每月加薪NT$8,000 (未滿六天按比率計算 ) (3) 分紅獎勵：每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 B. 豐富寬廣的培訓發展，以及職涯升遷: (1) 專業訓練：全球最先進的中科訓練中心，十二吋廠儲備模組副工程師安排六周全職訓練課程 (2) 職涯升遷：垂直往上或水平轉換的職務機會，永不設限 C. 高規格的工作環境: (1) 美食饗宴：24小時提供多樣化異國美食 (2) 休假優給：給予優於勞基法之彈性休假及病假 Qualifications: 1. 具備大學學歷，且為電機、電子、機械、自動控制、冷凍空調工程等相關科系 2. 需有機械相關的基礎知識；有半導體製程知識者尤佳 3. 需有問題解決、溝通表達、團隊精神、主動學習等能力 4. 需有基本英文讀寫能力 5. 需能配合大多數工作時間內，穿著無塵衣且將在無塵室環境中工作 6. 需經過至多十二個月的相關訓練並通過認證，始得成為模組副工程師 7. 薪資：起薪38,700元起，年薪含分紅獎金、大夜津貼、夜班獎金、額外獎金

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC Advanced Packaging Technology and Service Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪38700~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4287&source=1111&tags=2024DomesticCampus_1111 Description: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device( logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Qualifications: 1. Bachelor‘s degree or above in Electrical/Electronic engineering, Computer engineering, Communication, Optical electronics or related fields. 2. Solid technical understanding of semiconductor testing concept. 3. Familiar with programming language. 4. Hands-on participation and a strong sense of ownership. 5. Fluent in English and exhibit good communication skills to work within cross-functional teams.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC Finance & Accounting 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪38700~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4294&source=1111&tags=2024DomesticCampus_1111 Description: 【Finance Associate】 The candidate will be positioned and rotate among different functions within Finance Division, including Financial Planning, Investment Management, Foreign Exchange Management, Funding and Cashier, Treasury Investment, Customer Credit, and SEC Compliance. 【Accounting Associate】 1. Provides financial information to management by researching and analyzing accounting data; preparing reports. 2. Rotate within Accounting: Reporting & Analysis Dept., Account service Dept.(Operations, R&D and SG&A), General Accounting Dept., Forecast and Planning Dept. Qualifications: 【Finance Associate】 1. MBA Graduate with excellent English. 2. 3-year experiences in banking or corporate finance will be a plus. 3. Excellent interpersonal, negotiation, and troubleshooting skill. 4. High EQ; capable of dealing with constructive confrontation. 5. Self-motivated and team player. 6. Skilled in MS Word, Excel and PowerPoint. 【Accounting Associate】 1. Bachelor‘s degree or above. 2. Major in Accounting or related field. 3. Working experiences in well-known international Accounting firms will be a plus. 4. CPA license will be a plus. 5. Engineering and computer science majors will be a plus.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC IT Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪38700~0元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4289&source=1111&tags=2024DomesticCampus_1111 Description: 1. Development and integration of Factory Automation Systems, or 2. Development and integration of Advanced Technology, or 3. Development and integration of Office Automation Systems, or 4. Development and integration of Cloud Computing, Kubernates or BigData Analytics Systems, or 5. Build/Development Scalable Platform for managing container applications. Qualifications: 1. Major in IT, Computer Engineering, Software Engineering, Computer Science or related fields. 2. Familiar with development of C/C++ or JAVA Programming, or 3. Familiar with Microservices Architecture Pattern, DevOps or 4. Familiar with Web Applications for PC and Mobiles, or 5. Familiar with Hadoop, Spark and Parallel Computing. 6. The ones with multiple above skill sets and experience is a plus. 7. Experience in large-scale system integration, cloud computing, social networking for factory automation is a plus. 8. Self-motivated, integrity, and result-oriented personality.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC Technician 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4300&source=1111&tags=2024DomesticCampus_1111 Description: 您可以根據所希望的工作地點和職務，投遞您的履歷到我們官網的以下職位： 1. 實驗室技術員 2. 龍潭先進封裝製造部技術員 3. 龍潭先進封裝工程部技術員 4. 竹科電子束作業處技術員 5. 竹科物流運籌系統部技術員 6. 竹南先進封裝製造部技術員 7. 竹南先進封裝工程部技術員 8. 中科技術員 9. 南科電子束作業處技術員 10. 南科物流運籌系統部技術員 11. 高雄製造部技術員(12吋廠) 12. 高雄工程部技術員(12吋廠) Qualifications: 1. 高中(職)以上畢業，不限科系 2. 細心、團隊溝通能力、自我學習能力、邏輯思考能力 3. 基本英文能力(機台介面)、Office 基本操作 4. 無經驗可，有相關經驗者尤佳

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC R&D Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4274&source=1111&tags=2024DomesticCampus_1111 Description: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration (2) New tool pathfinding for new materials to enable the next nodes (3) Design, execute and analyze experiments to meet R&D engineering specifications (4) Process stability & manufacturability improvement for yield and reliability qualification (5) Process/tool transfer to development R&D or volume manufacturing (Fab) (6) Highly motivated individuals with a strong technical background and teamwork skills 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Qualifications: 1. Passionate about the development of world-leading technologies. 2. Master‘s degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required.

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC DTP Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4275&source=1111&tags=2024DomesticCampus_1111 Description: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. 【Physical Designer】 The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 【Standard Cell Engineer】 1. Pathfinding of library characterization for leading edge tech nodes 2. Support industrial standard library kits generation and QC 3. In-house library generation flow and/or utility development 4. RC parasitic extraction analysis and APR related analysis 【Layout Engineer】 1. IC layout for advanced technology (Std. cell/Memory/AMS/IO) 2. Layout structure development for new technology 3. Pathfinding for new technology development 4. Customer engagement and layout support 5. Design and technology co-optimization (DTCO) 6. AI and automation for layout and physical design 【System and Chip Design Solutions Development】 Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 【FE design & DFT】 1. Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG) 2. Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. 3. Technology benchmarking for PPA evaluation of the advanced nodes 4. DTCO (Design & Technology Co-Optimization) pathfinding and development 【SRAM Engineer】 1. SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. 2. RRAM/MRAM, emerging memory development 3. In memory computing research and development 【Design Flow/Methodology】 1. Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support 2. Advanced technology design development flow development and technical support 3. Automation program development to support design kits and flow development productivity/quality Qualifications: 1. Master‘s degree in Electrical Engineering or Computer Engineering 2. Strong proficiency in speaking and writing English 3. Thorough understanding of place and route flow 4. Excellent interpersonal and communication skills 5. Self-motivated and possess excellent team spirit

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工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

【2024 Campus Recruitment】TSMC MtM RD Engineer 面試心得
企業名台灣積體電路製造股份有限公司(台積電)
工作地點新竹縣寶山鄉
薪資月薪32000~43000元
工作內容【本職缺僅接受台積電官方網站投遞】請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=4276&source=1111&tags=2024DomesticCampus_1111 Description: 1. Novel devices developing for specialty technology 2. Device Simulation, Test-chip design tape out and measurement system developing 3. Process flow developing for production 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing Qualifications: 1. Master‘s degree or above in an engineering or scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 2. Experienced in process integration or HV/BCD devices developing and characterization. 3. Innovative problem-solving skills 4. Familiar with TCAD simulation is a bonus 5. Process integration & CMOS characterization 6. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 7. Excellent communication skills and the ability to work within cross-functional teams, including internal and external partners.

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應徵

工作適配度－%

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根據履歷表的填寫狀況，智慧分析您與工作的適配程度。

5/10

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